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IBM11D2320H-60T PDF预览

IBM11D2320H-60T

更新时间: 2024-01-12 11:11:28
品牌 Logo 应用领域
国际商业机器公司 - IBM 动态存储器内存集成电路
页数 文件大小 规格书
20页 177K
描述
Fast Page DRAM Module, 2MX32, 60ns, CMOS, SIMM-72

IBM11D2320H-60T 技术参数

生命周期:Obsolete零件包装代码:SIMM
包装说明:SIMM, SSIM72针数:72
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.02风险等级:5.84
Is Samacsys:N访问模式:FAST PAGE
最长访问时间:60 ns其他特性:RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
备用内存宽度:16I/O 类型:COMMON
JESD-30 代码:R-XSMA-N72内存密度:67108864 bit
内存集成电路类型:FAST PAGE DRAM MODULE内存宽度:32
功能数量:1端口数量:1
端子数量:72字数:2097152 words
字数代码:2000000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:2MX32输出特性:3-STATE
封装主体材料:UNSPECIFIED封装代码:SIMM
封装等效代码:SSIM72封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY电源:5 V
认证状态:Not Qualified刷新周期:2048
座面最大高度:25.4 mm自我刷新:NO
最大待机电流:0.004 A子类别:DRAMs
最大压摆率:0.36 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:CMOS
温度等级:COMMERCIAL端子形式:NO LEAD
端子节距:1.27 mm端子位置:SINGLE
Base Number Matches:1

IBM11D2320H-60T 数据手册

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IBM11D2320H2M  
x 3210/10, 5.0V, LC, Sn/PbMMDS45DSU-021040820. MMDS45DSU-021040820.  
IBM11D2320H  
2M x 32 DRAM Module  
Features  
• 72-Pin Single-In-Line Memory Module  
• Performance:  
• Thin outline (.104”)  
• Single 5V ± 0.5V Power Supply  
• Low current consumption  
• All inputs & outputs are fully TTL & CMOS  
compatible  
• Fast Page access cycle  
• Refresh Modes: RAS-Only, CBR, and Hidden  
Refresh  
• 2098 refresh cycles distributed across 32ms  
• 11/10 Addressing (Row/Column)  
• Optimized for use in byte-write, non-parity appli-  
cations.  
-60  
-70  
tRAC  
tCAC  
tAA  
RAS Access Time  
CAS Access Time  
60ns 70ns  
15ns 20ns  
Access Time From Address 30ns 35ns  
tRC  
Cycle Time  
110ns 130ns  
40ns 45ns  
tHPC  
EDO Mode Cycle Time  
• Tin/lead versions only  
• DRAMs in TSOP package  
• High Performance CMOS process  
• Manufactured with 16Mb DRAMS (2M x 8)  
Description  
The IBM11D2320H is an 8MB 72-pin 4-byte single  
in-line memory module (SIMM). The module is orga-  
nized as a 2Mx32 high speed memory array and is  
configured as one 2Mx32 bank. The assembly is  
intended for use in 16, 32 and 64 bit applications. It  
is manufactured with four 2Mx8 devices, each in a  
400mil TSOP pkg. and is compatible with applica-  
tions that support 11/10 (Row/Column) addressing.  
The use of TSOP packages allows tight SIMM spac-  
ing (.3” on center).  
The IBM 72-Pin SIMMs provide a high performance,  
flexible 4-byte interface in a 4.25” long footprint.  
Card Outline  
1
36  
37  
72  
©IBM Corporation. All rights reserved.  
Use is further subject to the provisions at the end of this document.  
75H1697  
SA14-4338-01  
Revised 6/96  
Page 1 of 20  

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