Datasheet > IAF12020A007V

IAF12020A007V

更新时间： 2022-11-07 22:06:01

品牌	Logo	应用领域
东电化 - TDK		电源电路
页数	文件大小	规格书
18页	1113K
描述
iAF Series – Non-isolated SMT Power Module

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IAF12020A007V 数据手册

Advance Data Sheet: iAF Series – Non-isolated SMT Power Module

Ordering information:

Product

Identifier

Package Size

Platform

Input

Voltage

Output

Current/

Power

Units

Main

Output

Voltage

# of

Outputs

Safety

Class

Feature Set

RoHS

Indicator

020

007

R=RoHS 6

Compliant

4.5V to

14V

See option

table

TDK

Innoveta

33mm x

13.5mm

0.70V to

5.5V

iAF

Amps

Single

Option Table:

LGA Solder

Bumping*

EPC Solder

Bumping*

Product Label

Marking

Positive

Logic On/Off

Negative

Logic On/Off

Feature Set

Sequence

-000

-001

-002

-003

-004

-005

-006

-007

LGA solder bumping option is recommended for customers using the DOSA standard land grid array

footprint and EPC soldering bumping is recommended for customers using the inspectable edge plated

castellation pads

Product Offering:

Maximum

Output Power

Code

Input Voltage

Output Voltage

Output Current

Efficiency

95%

iAF12020A007V

4.5V-14V

0.70V-5.5V

20A

110W

3320 Matrix Drive, Suite 100

Richardson, TX 75802

Phone (877) 498-0099 Toll Free

(469) 916-4747

Fax

(877) 498-0143 Toll Free

(214) 239-3101

support@tdkinnoveta.com

http://www.tdkinnoveta.com/

℡

(877) 498-0099

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