Datasheet > HYB18RL28836AC-3.3

HYB18RL28836AC-3.3

更新时间： 2024-02-21 12:32:19

品牌	Logo	应用领域
英飞凌 - INFINEON		动态存储器双倍数据速率内存集成电路
页数	文件大小	规格书
50页	736K
描述
DDR DRAM, 8MX36, CMOS, PBGA144, PLASTIC, TFBGA-144

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HYB18RL28836AC-3.3 技术参数

生命周期：	Obsolete	零件包装代码：	BGA
包装说明：	TBGA,	针数：	144
Reach Compliance Code：	unknown	ECCN代码：	EAR99
HTS代码：	8542.32.00.28	风险等级：	5.84
访问模式：	MULTI BANK PAGE BURST	其他特性：	AUTO REFRESH
JESD-30 代码：	R-PBGA-B144	长度：	18.5 mm
内存密度：	301989888 bit	内存集成电路类型：	DDR DRAM
内存宽度：	36	功能数量：	1
端口数量：	1	端子数量：	144
字数：	8388608 words	字数代码：	8000000
工作模式：	SYNCHRONOUS	组织：	8MX36
封装主体材料：	PLASTIC/EPOXY	封装代码：	TBGA
封装形状：	RECTANGULAR	封装形式：	GRID ARRAY, THIN PROFILE
认证状态：	Not Qualified	座面最大高度：	1.2 mm
最大供电电压 (Vsup)：	1.9 V	最小供电电压 (Vsup)：	1.7 V
标称供电电压 (Vsup)：	1.8 V	表面贴装：	YES
技术：	CMOS	端子形式：	BALL
端子节距：	1 mm	端子位置：	BOTTOM
宽度：	11 mm	Base Number Matches：	1

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HYB18RL28818/36AC

288 Mbit DDR Reduced Latency DRAM

Edition July 2003

This edition was realized using the software system FrameMaker .

Published by Infineon Technologies,

Marketing-Kommunikation,

Balanstraße 73,

81541 München

Attention please!

As far as patents or other rights of third parties are concerned, liability is only assumed for components, not for applications, processes and circuits imple-

mented within components or assemblies.

The information describes the type of component and shall not be considered as assured characteristics.

Terms of delivery and rights to change design reserved.

For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infineon Technologies Companies

and Representatives worldwide (see address list).

Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest In-

fineon Technologies Office.

Infineon Technologies is an approved CECC manufacturer.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing

material back, if it is sorted. You must bear the costs of transport.

For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose!

Critical components of Infineon Technologies, may only be used in life-support devices or systems with the express written approval of Infineon Tech-

nologies.

1 A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-

support device or system, or to affect its safety or effectiveness of that device or system.

2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they

fail, it is reasonable to assume that the health of the user may be endangered.

HYB18RL28818/36AC

Revision History: Current Version 1.60

Subjects (major changes since last revision)

Previous Version: 1.51

frontpage

fixed part number HYB18RL28809AC -> HYB18RL28890AC

removed confidential

all

x36 configuration table, swapped pins F12 and E12

Ball Description table - ZQ - added ‘...connected to GND, then minimum DQ output impedance is set.’

Re-numbered scan registers order, starting with 0 to 112

Removed the word “Isolated” from the Vddq power supply description in table 18

Added note 7 for Vtt. A power supply should be used for Vtt generation, not a voltage divider.

Changed the value of tMRSC from 6 to 12 clocks

46,47,48

Figure 40, Tap Block Diagram. Added numbering to scan chain order.

Added tCKvar, added notes 4 and 5. (jitter parameter)

Add to ZQ, QVLD, DQ, QK that the output impedance of QVLD, DQ, and QKx is controlled via ZQ

Comment that states each RD/WR is a row access, wait tRC before next RD/WR to same bank.

added: (8k refresh per bank, 64k total refresh cycles each 32ms)

Idle means all commands complete, no more burst or refresh occuring

Added power estimates.

20,21,25

5,52

all

5,52

all

Remove 1.5v VDDQ option

Removed x9 option

Version 1.60

Page 2

Infineon Technologies

This specification is preliminary and subject to change without notice

123 4 5 6 7...50

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