HT45R34
Pin Description
Pin Name I/O
Options
Description
Bidirectional 8-bit I/O port. Each pin can be configured as a wake-up input via con-
figuration options. Software instructions determine if the pin is a CMOS output or
Schmitt trigger input. Pull-high resistors can be added to the each pin via a configu-
PA0/INT0
PA1/INT1
I/O
Pull-high* ration option.
PA2/TMR
Wake-up Pins PA0 and PA1 are pin-shared with external interrupt input pins INT0 and INT1,
respectively. Configuration options determine the interrupt enable/disable and the
interrupt low/high trigger type. Pins PA2 is pin-shared with the external timer input
pins TMR.
PA3~PA7
RC1~RC12
RCOUT
IN
I
I
Capacitor or resistor connection pins
Capacitor or resistor connection pin to RC OSC
Oscillation input pin
¾
¾
¾
¾
¾
¾
¾
¾
I
RREF
CREF
RES
O
O
I
Reference resistor connection pin
Reference capacitor connection pin
Schmitt trigger reset input. Active low
Negative power supply, ground
VSS
¾
¾
VDD
Positive power supply
OSC1, OSC2 are connected to an RC network or Crystal determined by a configu-
OSC1
OSC2
I
Crystal or RC ration option, for the internal system clock. In the case of the RC oscillator, OSC2
can be used to monitor the system clock. Its frequency is 1/4 system clock.
O
Note: *All pull-high resistors are controlled by an option bit.
Absolute Maximum Ratings
Supply Voltage...........................VSS-0.3V to VSS+6.0V
Input Voltage..............................VSS-0.3V to VDD+0.3V
IOL Total ..............................................................300mA
Total Power Dissipation .....................................500mW
Storage Temperature............................-50°C to 125°C
Operating Temperature...........................-40°C to 85°C
IOH Total............................................................-200mA
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed
in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
D.C. Characteristics
Ta=25°C
Test Conditions
Conditions
Symbol
Parameter
Min.
Typ.
Max.
Unit
VDD
fSYS=4MHz
2.2
3.3
¾
5.5
5.5
2
V
V
¾
¾
1
VDD
Operating Voltage
¾
f
SYS=8MHz
3V
5V
mA
mA
Operating Current
IDD1
IDD2
ISTB1
No load, fSYS=4MHz
No load, fSYS=8MHz
No load, system HALT
(Crystal OSC, RC OSC)
3
5
¾
Operating Current
5V
4
8
mA
¾
(Crystal OSC, RC OSC)
3V
5V
5
¾
¾
¾
¾
mA
mA
Standby Current (WDT Enabled)
10
Rev. 1.20
3
October 15, 2007
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