HSSR-7112

更新时间： 2024-01-06 14:21:12

品牌	Logo	应用领域
安华高科 - AVAGO		/
页数	文件大小	规格书
11页	143K
描述
90 V/1.0 , Hermetically Sealed, Power MOSFET Optocoupler QML-38534

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HSSR-7112 数据手册

HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E

5962-93140

90 V/1.0 Ω, Hermetically Sealed, Power MOSFET Optocoupler

Data Sheet

Description

Features

The HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E and

SMD 5962-93140 are single channel power MOSFET opto-

couplers, constructed in eight-pin, hermetic, dual-in-line,

ceramic packages. The devices operate exactly like a solid-

state relay.

 Dual Marked with Device Part Number and DLA

Standard Microcircuit Drawing

 ac/dc Signal &Power Switching

 Compact Solid-State Bidirectional Switch

 Manufactured and Tested on a MIL-PRF-38534Certiﬁed

The products are capable of operation and storage over

the full military temperature range and may be pur-

chased as a standard product (HSSR-7110), with full MIL-

PRF-38534 Class H testing (HSSR-7111 and HSSR- 7112),

with MIL-PRF-38534 Class E testing (Class K with excep-

tions) (HSSR-711E) or from the DLA Standard Microcircuit

Drawing (SMD) 5962-93140. Details of the Class E program

may be found on page 11 of this datasheet.

Line

 QML-38534

 MIL-PRF-38534 Class H

 Modiﬁed Space Level Processing Available (Class E)

 Hermetically Sealed 8-Pin Dual In-Line Package

 Small Size and Weight

 Performance Guaranteed over -55°C to 125°C

 Connection A0.8 A, 1.0 Ω

Functional Diagrams

CONNECTION A

AC/DC CONNECTION

CONNECTION B

DC CONNECTION

 Connection B1.6 A, 0.25 Ω

 1500 Vdc Withstand Test Voltage

 High Transient Immunity

 5 Amp Output Surge Current

Applications

 Military and Space

TRUTH TABLE

 High Reliability Systems

 Standard 28 Vdc and 48 Vdc Load Driver

 Standard 24 Vac Load Driver

 Aircraft Controls

INPUT

OUTPUT

CLOSED

OPEN

 ac/dc Electromechanical and Solid State Relay

Replacement

 I/O Modules

 Harsh Industrial Environments

CAUTION: It is advised that normal static precautions be taken in handling and assembly

of this component to prevent damage and/or degradation which may be induced by ESD.

12 3 4 5 6 7...11

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