Datasheet > HSMC-H730

HSMC-H730

更新时间： 2024-10-02 19:55:27

品牌	Logo	应用领域
安捷伦 - AGILENT		/
页数	文件大小	规格书
8页	138K
描述
Visible LED, Diffused

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中文翻译

获取价格

技术参数
数据手册

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HSMC-H730 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
Reach Compliance Code：	unknown	风险等级：	5.92
颜色@波长：	Orange-Red	最大正向电流：	0.02 A
最大正向电压：	2.2 V	JESD-609代码：	e0
透镜类型：	DIFFUSED	最小发光强度：	165 cd
最高工作温度：	85 °C	最低工作温度：	-40 °C
总高度：	1.1 mm	峰值波长：	638 nm
最大反向电压：	5 V	子类别：	Visible LEDs
端子面层：	Tin/Lead (Sn/Pb)	视角：
Base Number Matches：	1

HSMC-H730 数据手册

High Performance Reverse

Mount Flip Chip LEDs

Technical Data

SunPower Series

HSMA-H630/H730

HSMC-H630/H730

HSML-H630/H730

Features

Applications

• High Brightness AlInGaP

Material

• Reverse Mountable Surface

Mount LED

• Breakthrough Reliability

through Elimination of

Internal Wire Bond

• -40°C to +85°C Operating

Temperature Range

• Small 3.2 x 1.25 mm

Footprint

• Low Profile

• Keypad Backlighting

• Symbol Backlighting

• Status Indication

• Front Panel Indicator

Description

The HSMx-H630/H730 is a

reverse mountable chip-type LED

for lighting the non-component

side of a PC board. In this reverse

mounting configuration, this LED

is designed to emit light through

a small hole in the PC board.

• Diffused Optics

This device is available in three

colors. The small size, narrow

footprint, and low profile make

these LEDs excellent for

backlighting, status indication,

and front panel illumination

applications.

• Compatible with Reflow or

Through-the-Wave Solder

Processes

• Available on 7” (178 mm) or

13” (330 mm) Diameter

Reels

The HSMx-H630/H730 uses a flip

chip construction that eliminates

the wire bond between the chip

and substrate. As a result of this

robust construction, product

reliability is greatly improved.

Part Number

Color

Amber 590 nm

Part/Reel

HSMA-H630

HSMA-H730

3000

12000

HSMC-H630

HSMC-H730

Red 626 nm

3000

12000

HSML-H630

HSML-H730

Orange 605 nm

3000

12000

12 3 4 5 6 7 8

中文翻译

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