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HSMC-H770 PDF预览

HSMC-H770

更新时间: 2024-10-02 19:46:43
品牌 Logo 应用领域
安捷伦 - AGILENT 光电
页数 文件大小 规格书
10页 217K
描述
Single Color LED, Red, Diffused, 1.27mm

HSMC-H770 技术参数

是否Rohs认证: 不符合生命周期:Transferred
Reach Compliance Code:unknownHTS代码:8541.40.20.00
风险等级:5.21其他特性:HIGH RELIABILITY
颜色:RED颜色@波长:Red
配置:SINGLE最大正向电流:0.02 A
最大正向电压:2.4 VJESD-609代码:e0
透镜类型:DIFFUSED标称发光强度:30 mcd
安装特点:SURFACE MOUNT功能数量:1
端子数量:2最高工作温度:85 °C
最低工作温度:-40 °C光电设备类型:SINGLE COLOR LED
总高度:1.1 mm包装方法:TAPE AND REEL
峰值波长:638 nm最大反向电压:5 V
形状:RECTANGULAR尺寸:1.27 mm
子类别:Visible LEDs表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)端子节距:2.35 mm
视角:165 degBase Number Matches:1

HSMC-H770 数据手册

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High Performance Surface  
Mount Flip Chip LEDs  
Technical Data  
HP SunPower Series  
HSMA-H670/H690/H770/  
H790/R661/R761  
HSMC-H670/H690/H770/  
H790/R661/R761  
HSML-H670/H690/H770/  
H790/R661/R761  
Applications  
Features  
• Keypad Backlighting  
• LCD Backlighting  
• Symbol Backlighting  
• Front Panel Indicator  
• High Brightness AlInGaP  
Material  
• Improved Reliability  
through Elimination of  
Internal Wire Bond  
• -40 to 85°C Operating  
Temperature Range  
Description  
The HSMx-H670/H770, -H690/  
H790, and -R661/R761 combine  
high reliability surface mount flip  
chip LED construction with HP’s  
bright AlInGaP material. These  
very small, bright LEDs have a  
high luminous efficiency capable  
of producing high light output over  
a wide range of drive currents. The  
590 nm amber, 605 nm orange,  
and 626 nm red colors are  
• Three Small Package Sizes  
• Industry Standard  
2.0 x 1.25 mm and  
1.6 x 0.8 mm Footprints  
H790 has the industry standard  
1.6 x 0.8 mm footprint, and its low  
0.6 mm profile and wide viewing  
angle make this LED excellent for  
backlighting applications.  
• Right Angle Package  
• Three Colors Available  
• Diffused Optics  
• Compatible with IR and  
Through-the-wave Solder  
Processes  
• Available in 8 mm Tape on  
178 mm (7") and 330 mm  
(13") Diameter Reels  
The HSMx-R661/R761 has a small  
2.1 x 1.3 mm footprint and a low  
profile 0.7 mm height that makes  
this part ideal for LCD backlighting  
and sidelighting applications  
where space is at a premium. All  
packages are compatible with IR  
and convective reflow soldering  
processes. In addition, these parts  
are also compatible with through-  
the-wave soldering processes.  
available in three compact, low  
profile packages.  
The HSMx-H670/H770 has the  
industry standard 2.0 x 1.25 mm  
footprint that is excellent for all  
around use. The HSMx-H690/  

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