Spec. No. : HSL200102
Issued Date : 2001.11.01
Revised Date : 2001.11.22
Page No. : 12/12
HI-SINCERITY
MICROELECTRONICS CORP.
SOD-323 Dimension
Marking:
K
A
X X
2
1
B
Style: Pin 1.Cathode 2.Anode
D
C
J
H
E
2-Lead SOD-323 Plastic Surface Mounted Package, HSMC Package Code: SL
*: Typical
Millimeters
Inches
Millimeters
Inches
Min.
DIM
DIM
Min.
Max.
Min.
Max.
1.80
1.35
1.00
0.40
Max.
-
Min.
0.15
0.00
0.089
2.30
Max.
-
0.10
0.177
2.70
A
B
C
D
0.0630
0.0453
0.0315
0.0098
0.0709
0.0531
0.0394
0.0157
1.60
1.15
0.80
0.25
E
H
J
0.0060
0.0000
0.0035
0.0906
0.0040
0.0070
0.1063
K
Notes: 1.Dimension and tolerance based on our Spec. dated DEC. 20, 2000.
2.Controlling dimension : millimeters.
3.Lead thickness specified per L/F drawing with solder plating.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMSZ52XXB Series
HSMC Product Specification