Datasheet > 射频和微波 > 射频/微波放大器> HMC599ST89TR

HMC599ST89TR

更新时间： 2024-02-04 18:21:24

品牌	Logo	应用领域
HITTITE		放大器
页数	文件大小	规格书
8页	732K
描述
Wide Band Low Power Amplifier,

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技术参数
数据手册

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HMC599ST89TR 技术参数

生命周期：	Transferred	Reach Compliance Code：	unknown
风险等级：	5.65	射频/微波设备类型：	WIDE BAND LOW POWER
Base Number Matches：	1

HMC599ST89TR 数据手册

HMC599ST89 / 599ST89E

v02.0311

GaAs pHEMT MMIC LNA, 75 Ohm

50 - 1000 MHz

Absolute Maximum Ratings

Typical Supply Current vs. Vdd

Drain Bias Voltage (Vdd)

rf inꢈut pꢄꢅꢀꢃ (rfiN)

Channꢀꢆ Tꢀꢇꢈꢀꢃatuꢃꢀ

+6 Vdc

Vdd (Vdc)

idd (ꢇA)

+10 dBꢇ

175 °C

120

Cꢄntꢁnuꢄuꢂ pdꢁꢂꢂ (T = 85 °C)

(dꢀꢃatꢀ 9.84 ꢇw/°C abꢄvꢀ 85 °C)

0.89 w

Thꢀꢃꢇaꢆ rꢀꢂꢁꢂtancꢀ

(junctꢁꢄn tꢄ gꢃꢄund ꢈaddꢆꢀ)

101.67 °C/w

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

stꢄꢃagꢀ Tꢀꢇꢈꢀꢃatuꢃꢀ

oꢈꢀꢃatꢁng Tꢀꢇꢈꢀꢃatuꢃꢀ

-65 tꢄ +150 °C

-40 tꢄ +85 °C

Outline Drawing

NoTes:

1. PACKAGE BODY MATERIAL:

MOLDING COMPOUND MP-180S OR EQUIVALENT.

2. LEAD MATERIAL: Cu w/ Ag SPOT PLATING.

3. LEAD PLATING: 100% MATTE TIN.

4. DIMENSIONS ARE IN INCHES [MILLIMETERS]

5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15 mm PER SIDE.

6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25 mm PER SIDE.

7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.

Package Information

paꢃt Nuꢇbꢀꢃ

packagꢀ Bꢄdy matꢀꢃꢁaꢆ

lꢀad fꢁnꢁꢂh

msl ratꢁng

msl1 ^[1]

packagꢀ maꢃkꢁng ^[3]

H599

XXXX

HmC599sT89

lꢄꢅ stꢃꢀꢂꢂ injꢀctꢁꢄn mꢄꢆdꢀd pꢆaꢂtꢁc

sn/pb sꢄꢆdꢀꢃ

H599

XXXX

msl1 ^[2]

HmC599sT89e

rꢄHs-cꢄꢇꢈꢆꢁant lꢄꢅ stꢃꢀꢂꢂ injꢀctꢁꢄn mꢄꢆdꢀd pꢆaꢂtꢁc

100% ꢇattꢀ sn

[1] max ꢈꢀak ꢃꢀﬂꢄꢅ tꢀꢇꢈꢀꢃatuꢃꢀ ꢄꢉ 235 °C

[2] max ꢈꢀak ꢃꢀﬂꢄꢅ tꢀꢇꢈꢀꢃatuꢃꢀ ꢄꢉ 260 °C

[3] 4-Digit lot number XXXX

For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824

Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

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