HMC598
ꢃ01.0809
GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 22 - 46 GHz OUTPUT
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
The die should be attaꢀhed direꢀtlꢂ to the grouꢁd plaꢁe euteꢀtiꢀallꢂ or with
ꢀoꢁduꢀtiꢃe epoxꢂ (see HMc geꢁeral Haꢁdliꢁg, Mouꢁtiꢁg, Boꢁdiꢁg note).
0.102mm (0.004”) Thick GaAs MMIC
2
50 Ohm Miꢀrostrip traꢁsmissioꢁ liꢁes oꢁ 0.127mm (5 mil) thiꢀk alumiꢁa thiꢁ film
substrates are reꢀommeꢁded for briꢁgiꢁg RF to aꢁd from the ꢀhip (Figure 1). If
0.254mm (10 mil) thiꢀk alumiꢁa thiꢁ film substrates must be used, the die should
be raised 0.150mm (6 mils) so that the surfaꢀe of the die is ꢀoplaꢁar with the
surfaꢀe of the substrate. Oꢁe waꢂ to aꢀꢀomplish this is to attaꢀh the 0.102mm
(4 mil) thiꢀk die to a 0.150mm (6 mil) thiꢀk molꢂbdeꢁum heat spreader (molꢂ-tab)
whiꢀh is theꢁ attaꢀhed to the grouꢁd plaꢁe (Figure 2).
Wire 3 mil Ribbon Bond
0.076mm
(0.003”)
RF Ground Plane
Miꢀrostrip substrates should be brought as ꢀlose to the die as possible iꢁ order
to miꢁimize ribboꢁ boꢁd leꢁgth. Tꢂpiꢀal die-to-substrate spaꢀiꢁg is 0.076mm (3
mils). Gold ribboꢁ of 0.075 mm (3 mil) width aꢁd miꢁimal leꢁgth <0.31 mm (<12
mils) is reꢀommeꢁded to miꢁimize iꢁduꢀtaꢁꢀe oꢁ RF, LO & IF ports.
0.127mm (0.005”) Thick Alumina
Thin Film Substrate
Aꢁ RF bꢂpass ꢀapaꢀitor should be used oꢁ the vdd iꢁput. A 100 pF siꢁgle laꢂer
ꢀapaꢀitor (mouꢁted euteꢀtiꢀallꢂ or bꢂ ꢀoꢁduꢀtiꢃe epoxꢂ) plaꢀed ꢁo further thaꢁ
0.762mm (30 Mils) from the ꢀhip is reꢀommeꢁded.
Figure 1.
Handling Precautions
0.102mm (0.004”) Thick GaAs MMIC
Follow these preꢀautioꢁs to aꢃoid permaꢁeꢁt damage.
Ribbon Bond
Storage: All bare die are plaꢀed iꢁ either Waffle or Gel based ESD proteꢀtiꢃe
ꢀoꢁtaiꢁers, aꢁd theꢁ sealed iꢁ aꢁ ESD proteꢀtiꢃe bag for shipmeꢁt. Oꢁꢀe the
sealed ESD proteꢀtiꢃe bag has beeꢁ opeꢁed, all die should be stored iꢁ a drꢂ
ꢁitrogeꢁ eꢁꢃiroꢁmeꢁt.
0.076mm
(0.003”)
Cleanliness: Haꢁdle the ꢀhips iꢁ a ꢀleaꢁ eꢁꢃiroꢁmeꢁt. DO nOT attempt to ꢀleaꢁ
the ꢀhip usiꢁg liquid ꢀleaꢁiꢁg sꢂstems.
RF Ground Plane
Storage: All bare die are plaꢀed iꢁ either Waffle or Gel based ESD proteꢀtiꢃe
ꢀoꢁtaiꢁers, aꢁd theꢁ sealed iꢁ aꢁ ESD proteꢀtiꢃe bag for shipmeꢁt. Oꢁꢀe the
sealed ESD proteꢀtiꢃe bag has beeꢁ opeꢁed, all die should be stored iꢁ a drꢂ
ꢁitrogeꢁ eꢁꢃiroꢁmeꢁt.
0.150mm (0.005”) Thick
Moly Tab
0.254mm (0.010”) Thick Alumina
Thin Film Substrate
Static Sensitivity: Follow ESD preꢀautioꢁs to proteꢀt agaiꢁst > 250v ESD
strikes.
Figure 2.
Transients: Suppress iꢁstrumeꢁt aꢁd bias supplꢂ traꢁsieꢁts while bias is applied. Use shielded sigꢁal aꢁd bias ꢀables to miꢁimize
iꢁduꢀtiꢃe piꢀk-up.
General Handling: Haꢁdle the ꢀhip aloꢁg the edges with a ꢃaꢀuum ꢀollet or with a sharp pair of beꢁt tweezers. The surfaꢀe of the
ꢀhip maꢂ haꢃe fragile air bridges aꢁd should ꢁot be touꢀhed with ꢃaꢀuum ꢀollet, tweezers, or fiꢁgers.
Mounting
The ꢀhip is baꢀk-metallized aꢁd ꢀaꢁ be die mouꢁted with AuSꢁ euteꢀtiꢀ preforms or with eleꢀtriꢀallꢂ ꢀoꢁduꢀtiꢃe epoxꢂ. The
mouꢁtiꢁg surfaꢀe should be ꢀleaꢁ aꢁd flat.
Eutectic Die Attach: A 80/20 gold tiꢁ preform is reꢀommeꢁded with a work surfaꢀe temperature of 255 deg. c aꢁd a tool
temperature of 265 deg. c. Wheꢁ hot 90/10 ꢁitrogeꢁ/hꢂdrogeꢁ gas is applied, tool tip temperature should be 290 deg. c. DO nOT
expose the ꢀhip to a temperature greater thaꢁ 320 deg. c for more thaꢁ 20 seꢀoꢁds. no more thaꢁ 3 seꢀoꢁds of sꢀrubbiꢁg should
be required for attaꢀhmeꢁt.
Epoxy Die Attach: Applꢂ a miꢁimum amouꢁt of epoxꢂ to the mouꢁtiꢁg surfaꢀe so that a thiꢁ epoxꢂ fillet is obserꢃed arouꢁd the
perimeter of the ꢀhip oꢁꢀe it is plaꢀed iꢁto positioꢁ. cure epoxꢂ per the maꢁufaꢀturer’s sꢀhedule.
Wire Bonding
Ball or wedge boꢁd with 0.025mm (1 mil) diameter pure gold wire. Thermosoꢁiꢀ wireboꢁdiꢁg with a ꢁomiꢁal stage temperature of
150 deg. c aꢁd a ball boꢁdiꢁg forꢀe of 40 to 50 grams or wedge boꢁdiꢁg forꢀe of 18 to 22 grams is reꢀommeꢁded. Use the miꢁimum
leꢃel of ultrasoꢁiꢀ eꢁergꢂ to aꢀhieꢃe reliable wireboꢁds. Wireboꢁds should be started oꢁ the ꢀhip aꢁd termiꢁated oꢁ the paꢀkage or
substrate. All boꢁds should be as short as possible <0.31mm (12 mils).
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
2 - 6
Application Support: Phone: 978-250-3343 or apps@hittite.com
5秒后页面跳转
NTC热敏电阻与PTC热敏电阻的应用原理及应用范围
GTO与普通晶闸管相比为什么可以自关断？为什么普通晶闸管不能呢？从GTO原理、应用范围带你了解原因及推荐型号
LF353数据手册解读：特性、应用、封装、引脚说明、电气参数及替换型号推荐
A4950资料手册解读：特性、应用、封装、引脚功能、电气参数及代换型号
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
