HMC582LP5ETR

更新时间： 2024-01-04 18:55:59

品牌	Logo	应用领域
HITTITE		振荡器压控振荡器输出元件
页数	文件大小	规格书
6页	367K
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数据手册

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HMC582LP5ETR 数据手册

HMC582LP5 / 582LP5E

v03.0811

MMIC VCO w/ HALF FREQUENCY OUTPUT

& DIVIDE-BY-4, 11.1 - 12.4 GHz

Outline Drawing

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS]

3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.

4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.

PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.

5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.

6. ALL GROUND LEADS AND GROUND PADDLE MUST BE

SOLDERED TO PCB RF GROUND.

7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.

Package Information

Part Number

Package Body Material

Lead Finish

MSL Rating

MSL3 ^[1]

Package Marking ^[3]

H582

XXXX

HMC582LP5

Low Stress Injection Molded Plastic

Sn/Pb Solder

H582

XXXX

MSL3 ^[2]

HMC582LP5E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

[1] Max peak reﬂow temperature of 235 °C

[2] Max peak reﬂow temperature of 260 °C

[3] 4-Digit lot number XXXX

Pin Descriptions

Pin Number

Function

Description

Interface Schematic

1 - 3, 8 - 10, 13 - 18,

20, 22 - 28, 30 - 32

No Connection. These pins may be connected to RF/

DC ground. Performance will not be affected.

N/C

RFOUT/4

Divide-by-4 output. DC block required.

Supply voltage for prescaler. If prescaler is not

required, this pin may be left open to conserve

approximately 65 mA of current.

Vcc (Dig)

For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824

Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

8 - 4

1 2 345 6

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