HMC511LP5/511LP5E
v06.0114
MMIC VCO WITH HALF FREQUENCY OUTPUT
9.05 - 10.15 GHz
Outline Drawing
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
LAND PATTERN.
Package Information
Part Number
Package Body Material
Lead Finish
MSL Rating
MSL3 [1]
Package Marking [3]
H511
XXXX
HMC511LP5
Low Stress Injection Molded Plastic
Sn/Pb Solder
H511
XXXX
MSL3 [2]
HMC511LP5E
RoHS-compliant Low Stress Injection Molded Plastic
100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
For price, delivery, and to place orders: Analog Devices, Inc.,
resFpoonrsibpilirtyicisea,ssdumeeldivbey ArynalaognDdevticoespfolar itcseuseo, rndoreforrsa:nyHinifrtitnigteemeMntsicofrpoawtenatsvoer oCtheorrporation, 2 Elizabeth Drive, Chelmsford, MA 01824
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
rights of third parties that may result from its use. Specifications subject to change without notice. No
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Phone: 781-329-4700 • Order online at www.analog.com
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks arAe tphepplriocpearttyioofntheSir urespppecotivret:owPnehrso. ne: 978-250-3343 or apps@hittite.com
4
Application Support: Phone: 1-800-ANALOG-D