HMC487LP5 / 487LP5E
v01.0705
SURFACE MOUNT PHEMT 2 WATT POWER
AMPLIFIER, 9 - 12 GHz
5
Typical Supply Current vs. Vdd
Power Dissipation*
10.5
Vdd (Vdc)
Idd (mA)
10
+6.5
1330
Max Pdiss @ +85C
9.5
9
+7.0
1300
+7.5
1285
8.5
8
Note: Amplifier will operate over full voltage ranges shown
above. Vgg adjusted to achieve Idd= 1300 mA at +7.0V.
11 GHz
7.5
7
Absolute Maximum Ratings
Drain Bias Voltage (Vdd1, 2, 3, 4, 5)
6.5
6
+8 Vdc
5.5
5
Gate Bias Voltage (Vgg)
-2.0 to 0 Vdc
RF Input Power (RFin)(Vdd = +7.0 Vdc) +20 dBm
-10 -8 -6 -4 -2
0
2
4
6
8
10 12 14 16
Channel Temperature
150 °C
10 W
INPUT POWER (dBm)
Continuous Pdiss (T= 85 °C)
(derate 154 mW/°C above 85 °C)
* Refer to “Thermal Management for Surface Mount
Components” application note herein.
Thermal Resistance
(channel to ground paddle)
6.5 °C/W
Storage Temperature
Operating Temperature
-65 to +150 °C
-40 to +85 °C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
LAND PATTERN.
Package Information
Part Number
Package Body Material
Lead Finish
MSL Rating
MSL1 [1]
Package Marking [3]
H487
XXXX
HMC487LP5
Low Stress Injection Molded Plastic
Sn/Pb Solder
H487
XXXX
MSL1 [2]
HMC487LP5E
RoHS-compliant Low Stress Injection Molded Plastic
100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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