Datasheet > HMC318MS8G_07

HMC318MS8G_07

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
HITTITE		放大器
页数	文件大小	规格书
6页	243K
描述
GaAs MMIC LOW NOISE AMPLIFIER with AGC, 5.0 - 6.0 GHz

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数据手册

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HMC318MS8G_07 数据手册

HMC318MS8G / 318MS8GE

v02.0607

GaAs MMIC LOW NOISE AMPLIFIER

with AGC, 5.0 - 6.0 GHz

Outline Drawing

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS].

3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.

4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.

5. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO

PCB RF GROUND.

Package Information

Part Number

Package Body Material

Lead Finish

MSL Rating

MSL1 ^[1]

Package Marking ^[3]

H318

XXXX

HMC318MS8G

HMC318MS8GE

Low Stress Injection Molded Plastic

Sn/Pb Solder

H318

XXXX

MSL1 ^[2]

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

[1] Max peak reﬂow temperature of 235 °C

[2] Max peak reﬂow temperature of 260 °C

[3] 4-Digit lot number XXXX

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

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