生命周期: | Obsolete | 包装说明: | DIP, |
Reach Compliance Code: | unknown | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.41 | 风险等级: | 5.74 |
Is Samacsys: | N | 最长访问时间: | 45 ns |
JESD-30 代码: | R-GDIP-T20 | 内存密度: | 16384 bit |
内存集成电路类型: | STANDARD SRAM | 内存宽度: | 1 |
功能数量: | 1 | 端子数量: | 20 |
字数: | 16384 words | 字数代码: | 16000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 16KX1 | |
封装主体材料: | CERAMIC, GLASS-SEALED | 封装代码: | DIP |
封装形状: | RECTANGULAR | 封装形式: | IN-LINE |
并行/串行: | PARALLEL | 认证状态: | Not Qualified |
座面最大高度: | 5.08 mm | 标称供电电压 (Vsup): | 5 V |
表面贴装: | NO | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子形式: | THROUGH-HOLE |
端子节距: | 2.54 mm | 端子位置: | DUAL |
宽度: | 7.62 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
HM165767BM-5:D | TEMIC |
获取价格 |
Standard SRAM, 16KX1, 45ns, CMOS, CDIP20, 0.300 INCH, CERAMIC, PACKAGE-20 |
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HM165767BN-2 | TEMIC |
获取价格 |
Standard SRAM, 16KX1, 55ns, CMOS, CDIP20, |
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HM165767BN-2/883 | TEMIC |
获取价格 |
Standard SRAM, 16KX1, 55ns, CMOS, CDIP20, 0.300 INCH, CERAMIC, PACKAGE-20 |
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HM165767BN-2/883:D | TEMIC |
获取价格 |
Standard SRAM, 16KX1, 55ns, CMOS, CDIP20, |
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HM165767BN-2:D | TEMIC |
获取价格 |
Standard SRAM, 16KX1, 55ns, CMOS, CDIP20, |
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HM165767BN-5:D | TEMIC |
获取价格 |
Standard SRAM, 16KX1, 55ns, CMOS, CDIP20, |
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HM1-65767F-5+ | TEMIC |
获取价格 |
Standard SRAM, 16KX1, 20ns, CMOS, CDIP20, |
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HM1-65767H-2 | ETC |
获取价格 |
x1 SRAM |
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HM1-65767H-5 | TEMIC |
获取价格 |
Standard SRAM, 16KX1, 25ns, CMOS, CDIP20, |
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HM1-65767H-8 | ETC |
获取价格 |
x1 SRAM |
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