目录
4.2.11 PLL 特性........................................................................................................................................... 27
4.2.12 Flash 存储器特性............................................................................................................................ 27
4.2.13 IO 输入引脚特性 ............................................................................................................................ 27
4.2.14 IO 输出引脚特性 ............................................................................................................................ 28
4.2.15 NRST 复位管脚特性 ....................................................................................................................... 28
4.2.16 TIM 计数器特性.............................................................................................................................. 29
4.2.17 电机加速单元(EMACC)特性 .................................................................................................... 29
4.2.18 ADC 特性.......................................................................................................................................... 29
4.2.19 DAC 分压器特性 ............................................................................................................................. 32
4.2.20 温度传感器特性............................................................................................................................. 32
4.2.21 电压比较器(COMP)特性 .......................................................................................................... 32
4.2.22 运算放大器(OPAMP)特性........................................................................................................ 33
5 典型电路................................................................................................................................................................... 34
5.1 电源供电 ....................................................................................................................................................... 34
6 引脚定义................................................................................................................................................................... 35
6.1 LQFP48 封装.................................................................................................................................................. 35
6.2 LQFP44 封装.................................................................................................................................................. 36
6.3 LQFP32 封装.................................................................................................................................................. 37
6.4 QFN32 封装................................................................................................................................................... 38
6.5 TSSOP24 封装................................................................................................................................................ 38
6.6 各封装的引脚定义....................................................................................................................................... 39
6.7 引脚复用(AF)功能表 .............................................................................................................................. 48
7 封装参数................................................................................................................................................................... 51
7.1 封装尺寸 ....................................................................................................................................................... 51
7.1.1 LQFP48 封装...................................................................................................................................... 51
7.1.2 LQFP44 封装...................................................................................................................................... 52
7.1.3 LQFP32 封装...................................................................................................................................... 54
7.1.4 QFN32 封装....................................................................................................................................... 55
7.1.5 TSSOP24 封装.................................................................................................................................... 56
7.2 丝印信息 ....................................................................................................................................................... 58
7.2.1 LQFP48 丝印...................................................................................................................................... 58
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