目录
4.2.10 PLL 特性 .....................................................................................................................................27
4.2.11 Flash 存储器特性 ......................................................................................................................27
4.2.12 IO 输入引脚特性.......................................................................................................................28
4.2.13 IO 输出引脚特性.......................................................................................................................28
4.2.14 NRST 复位管脚特性 ..................................................................................................................28
4.2.15 TIM 计数器特性 ........................................................................................................................28
4.2.16 ADC 特性....................................................................................................................................29
4.2.17 温度传感器特性.......................................................................................................................31
5 典型电路...........................................................................................................................................................32
6 管脚定义...........................................................................................................................................................33
6.1 LQFP64 封装 ...........................................................................................................................................33
6.2 LQFP48 封装 ...........................................................................................................................................34
6.3 LQFP32 封装 ...........................................................................................................................................35
6.4 QFN32 封装 ............................................................................................................................................36
6.5 QFN28 封装 ............................................................................................................................................37
6.6 TSSOP20 封装 .........................................................................................................................................38
6.7 各封装的管脚定义................................................................................................................................38
6.8 引脚复用（AF）功能表........................................................................................................................45
7 封装参数...........................................................................................................................................................48
7.1 封装尺寸................................................................................................................................................48
7.1.1 LQFP64 封装 ................................................................................................................................48
7.1.2 LQFP48 封装 ................................................................................................................................49
7.1.3 LQFP32 封装 ................................................................................................................................50
7.1.4 QFN32 封装..................................................................................................................................52
7.1.5 QNF28 封装..................................................................................................................................53
7.1.6 TSSOP20 封装 ..............................................................................................................................54
7.2 丝印信息................................................................................................................................................55
7.2.1 LQFP64 丝印 ................................................................................................................................55
7.2.2 LQFP48 丝印 ................................................................................................................................56
7.2.3 LQFP32 丝印 ................................................................................................................................56
7.2.4 QFN32 丝印..................................................................................................................................57
版权所有©2023深圳市航顺芯片技术研发有限公司
iv
5秒后页面跳转
高性能TDA7293音频功率放大器技术特性与应用分析
STM32H743技术深度剖析与应用案例探索
LM321中文资料解析：引脚功能介绍、技术特点、技术特性分析
74HC14芯片资料介绍：性能特性分析、引脚介绍
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
