4. Soldering
Precautions
◆Selection of Flux
1. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use;
（1） Flux used should be with less than or equal to 0.1 wt% （Chlorine conversion method） of halogenated content. Flux having a strong
acidity content should not be applied.
（2） When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level.
（3） When using water-soluble flux, special care should be taken to properly clean the boards.
◆Soldering
1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions, and please contact us
about peak temperature when you use lead-free paste.
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.）content is used to activate the flux, or highly acidic flux is used, an excessive
amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the
surface of the Inductor.
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may
detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high
humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The
cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux.
◆Soldering
1-1. Preheating when soldering
Preheating: Inductors shall be preheated sufficiently, and the temperature difference between the inductors and solder shall be within
130°C.
Cooling: The temperature difference between the components and cleaning process should not be greater than 100℃.
Inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering
process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock.
［Reflow soldering］
【Recommended condition for Pb-free soldering】 Caution
1. Solder (fillet) should wet up to 1/2 to 1/3 of the thickness of an inductor
ideally as shown below:
300
200
100
0
Peak
260℃ Max.
Within 10sec.
1/2T～1/3T
Inductor
Solder
T
Slow
cooling
PC board
2. Because excessive dwell time can detrimentally affect solderability,
soldering duration shall be kept as close to recommended time as possible.
3. The allowable number of reflow soldering is two (2) times.
Heating above
230℃
40sec. Max.
Preheating150℃
60sec. Min.
Technical
considerations
［Wave soldering］
【Recommended condition for Pb-free soldering】 Caution
300
200
100
0
1. Make sure the inductors are preheated sufficiently.
2. The temperature difference between the inductor and melted solder
should be within 130℃.
Peak
260℃ Max.
Within 10sec.
120sec. Min.
3. Cooling after soldering should be as gradual as possible.
4. The allowable number of wave soldering is one (1) time.
5. Wave soldering must not be applied to the inductors designated as for
reflow soldering only.
Slow
Preheating
150℃
cooling
［Hand soldering］
【Recommended condition for Pb-free soldering】 Caution
400
300
200
100
0
1. It is recommended to use a 20W soldering iron with a maximum tip
diameter of 1.0 mm.
Peak
350℃ Max.
Within 3sec.
2. The soldering iron shall not directly touch inductors
3. The allowable number of hand soldering is one (1) time
⊿T
Slow cooling
Preheating
150℃ Min.
60sec. Min.
（※⊿Ｔ≦150℃）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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