Contents
Contents
1
Introduction .............................................................................................................................13
1.1
Terminology........................................................................................................................14
1.1.1 Processor Packaging Terminology ........................................................................14
References .........................................................................................................................15
1.2
2
Electrical Specifications.....................................................................................................17
2.1
2.2
Power and Ground Lands...................................................................................................17
Decoupling Guidelines........................................................................................................17
2.2.1
2.2.2
V
V
Decoupling .....................................................................................................17
Decoupling......................................................................................................17
CC
TT
2.2.3 FSB Decoupling.....................................................................................................18
Voltage Identification ..........................................................................................................18
Reserved, Unused, and TESTHI Signals ...........................................................................20
Voltage and Current Specification ......................................................................................21
2.5.1 Absolute Maximum and Minimum Ratings.............................................................21
2.5.2 DC Voltage and Current Specification...................................................................22
2.3
2.4
2.5
2.5.3
V
Overshoot.......................................................................................................26
CC
2.5.4 Die Voltage Validation ...........................................................................................26
Signaling Specifications......................................................................................................27
2.6.1 FSB Signal Groups ................................................................................................27
2.6.2 GTL+ Asynchronous Signals .................................................................................29
2.6.3 Processor DC Specifications .................................................................................30
2.6.3.1 GTL+ Front Side Bus Specifications......................................................33
Clock Specifications............................................................................................................34
2.7.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ..................................34
2.7.2 FSB Frequency Select Signals (BSEL[2:0])...........................................................35
2.7.3 Phase Lock Loop (PLL) and Filter .........................................................................35
2.7.4 BCLK[1:0] Specifications .......................................................................................37
2.6
2.7
3
Package Mechanical Specifications..............................................................................39
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
Package Mechanical Drawing ............................................................................................39
Processor Component Keep-Out Zones.............................................................................43
Package Loading Specifications.........................................................................................43
Package Handling Guidelines.............................................................................................43
Package Insertion Specifications........................................................................................44
Processor Mass Specification.............................................................................................44
Processor Materials............................................................................................................44
Processor Markings............................................................................................................44
Processor Land Coordinates ..............................................................................................45
4
5
Land Listing and Signal Descriptions...........................................................................47
4.1
4.2
Processor Land Assignments.............................................................................................47
Alphabetical Signals Reference..........................................................................................70
Thermal Specifications and Design Considerations ..............................................79
5.1
Processor Thermal Specifications ......................................................................................79
5.1.1 Thermal Specifications ..........................................................................................79
Datasheet
3
5秒后页面跳转
压敏电阻器在直流电路中的过压保护应用探讨
电感耐压值及其与电感大小的关系
CNY17F光耦合器：特性、应用、封装、引脚功能及替换型号解析
DS1307资料解析：特性、引脚说明、替代推荐
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
