Multilayer Ceramic Capacitors
Approval Sheet
10. RELIABILITY TEST CONDITIONS AND REQUIREMENTS
No.
Item
Test Conditions
Requirements
1. Visual and
Mechanical
---
* No remarkable defect.
* Dimensions to conform to individual specification sheet.
2. Capacitance
3. Q/ D.F.
(Dissipation
Factor)
Cap≤1000pF, 1.0±0.2Vrms, 1MHz±10%
Cap>1000pF, 1.0±0.2Vrms, 1KHz±10%
At 25°C ambient temperature.
* Shall not exceed the limits given in the detailed spec.
* NP0: Cap≥30pF, Q≥1000; Cap<30pF, Q≥400+20C
4. Dielectric
Strength
* To apply voltage: ( ≤100V ) 250% of rated voltage.
* Duration: 1 to 5 sec.
* No evidence of damage or flash over during test.
* Charge and discharge current less than 50mA.
* To apply voltage:
200V~300V
≥2 times VDC
500V~999V
≥1.5 times VDC
* Cut-off, set at 10mA
* TEST= 15 sec.
* RAMP=0
5. Insulation
Resistance
Rated voltage:<200V
≥10GΩ
To apply rated voltage for max. 120 sec.
Rated voltage:200~630V
≥10GΩ or RxC≥100Ω-F whichever is smaller
* Capacitance change: within ±30ppm/°C
To apply rated voltage (500V max.) for 60 sec.
With no electrical load.
6. Temperature
Coefficient
Operating temperature: -55~125°C at 25°C
7. Adhesive
Strength of
Termination
8. Vibration
Resistance
* Pressurizing force：
* No remarkable damage or removal of the terminations.
2N (0201) and 5N (≤0603) and 10N (>0603)
* Test time: 10±1 sec.
* Vibration frequency: 10~55 Hz/min.
* Total amplitude: 1.5mm
* No remarkable damage.
* Cap change and Q/D.F.: To meet initial spec.
* Test time: 6 hrs. (Two hrs each in three mutually
perpendicular directions.)
* Cap./DF(Q) Measurement to be made after de-aging at
150°C for 1hr then set for 24±2 hrs at room temp.
* Solder temperature: 235±5°C
9. Solderability
95% min. coverage of all metalized area.
* Dipping time: 2±0.5 sec.
10. Bending Test * The middle part of substrate shall be pressurized by means * No remarkable damage.
of the pressurizing rod at a rate of about 1 mm per second until * Cap change: within ±5.0% or ±0.5pF whichever is larger.
the deflection becomes 1 mm and then the pressure shall be
maintained for 5±1 sec.
(This capacitance change means the change of capacitance under
specified flexure of substrate from the capacitance measured before
the test.)
* Measurement to be made after keeping at room temp. for
24±2 hrs.
11. Resistance to * Solder temperature: 260±5°C
Soldering Heat * Dipping time: 10±1 sec
* Preheating: 120 to 150°C for 1 minute before imme rse the
* No remarkable damage.
* Cap change: within ±2.5% or ±0.25pF whichever is larger.
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
* 25% max. leaching on each edge.
capacitor in a eutectic solder.
* Cap. / DF(Q) / I.R. Measurement to be made after de-aging
at 150°C for 1hr then set for 24±2 hrs at room temp .
Page 7 of 11
ASC_ HQ_Low ESR_(HH)_006V_AS
Dec. 2018
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