7
V
CC
C3
10
L1
1
L2
1
C1
20
Rx
Tx
GND
GND
1
2
22
21
20
19
18
17
16
15
14
13
12
GND
GND
NC
V
V
V
V
V
CC
CC
CC
CC
3
CC
4
C4
0.1
V
CC
C5
0.1
5
GND
GND
SD
6
GND
GND
GND
R1
82
R2
82
7
8
R5
82
R6
82
SD
9
V
V
CC
BB
DATA
DATA
DATA
DATA
10
11
DATA OUT DATA IN
DATA OUT DATA IN
GND
GND
R3
130
R4
130
R7
130
R8
130
TOP VIEW
C2
0.1
R9
82
R10
82
SIGNAL DETECT
SIGNAL DETECT
R11
130
R12
130
(a) HFBR-5111
13
12
11
10
9
8
7
6
5
4
3
2
1
GND
R6
82
R5
82
V
B
DATA IN
DATA IN
DATA IN
DATA IN
TX V
R8
R7
CC
L2
1
130
130
C4
0.1
GND
GND
TOP
VIEW
L1
1
RX V
CC
SD
V
CC
C5
0.1
C1
20
C2
0.1
C3
10
R9
82
R10
82
R2
82
R1
82
SD
SD
DATA OUT
DATA OUT
GND
SD
DATA OUT
DATA OUT
R11
130
R12
130
R4
130
R3
130
NOTES:
1. PLACE TERMINATION RESISTORS NEAR INPUT DATA PINS OF TRANSCEIVER AND PHY DEVICES.
2. MAKE DIFFERENTIAL SIGNAL PATHS SHORT AND OF THE SAME LENGTH WITH EQUAL TERMINATIONS TO V
– 2 VOLTS.
CC
3. SIGNAL TRACES SHOULD BE 50 Ω TRANSMISSION LINES: MICROSTRIP (OR STRIPLINE). USE GROUND PLANE
(OR MULTI-LAYER) PRINTED CIRCUIT BOARD FOR BEST HIGH FREQUENCY PERFORMANCE.
4. RESISTORS IN Ω. CAPACITORS IN MICROFARADS. INDUCTORS IN MICROHENRIES.
5. USE HIGH-FREQUENCY MONOLITHIC CERAMIC BYPASS CAPACITORS AND LOW SERIES DC RESISTANCE INDUCTORS.
FERRITE INDUCTORS CAN BE USED.
LOCATE POWER SUPPLY FILTER COMPONENTS CLOSE TO FIBER-OPTIC DEVICES.
6. CAUTION: DO NOT DIRECTLY CONNECT FIBER-OPTIC MODULE PECL OUTPUTS (DATA, DATA, SIGNAL DETECT, SIGNAL DETECT)
TO GROUND WITHOUT PROPER CURRENT LIMITING IMPEDANCE.
7. DEVICE GROUND PINS SHOULD BE DIRECTLY AND INDIVIDUALLY CONNECTED TO GROUND.
8. DEVICE SOLDER POSTS SHOULD BE DIRECTLY CONNECTED TO PCB FOR OPTIMUM MECHANICAL SUPPORT.
(b) HFBR-5112/-5113
Figure 7. Recommended Decoupling Circuit Diagram.