PD-2.498
HF40A060ACB
TARGET
HF40A060ACB Hexfred Die in Wafer Form
600 V
Size 40
4" Wafer
Electrical Characteristics ( Wafer Form )
Parameter
Description
Guaranteed (Min/Max)
Test Conditions
TJ = 25°C, IF = 10A
VFM
Forward Voltage
1.6V Max.
600V Min.
20µA Max.
BVR
Reverse Breakdown Voltage
Reverse Leakage Current
TJ = 25°C, IR = 250µA
TJ = 25°C, VR =600V
IRM
Mechanical Data
Norminal Backmetal Composition, Thickness:
Norminal Front Metal Composition, Thickness:
Dimensions:
Cr-Ni-Ag (1 kA-4kA-6kA )
99% Al, 1% Si (3 microns)
0.169" x 0.220"
Wafer Diameter:
100mm, with std. < 100 > flat
.015" + / -.003"
Wafer thickness:
Relevant Die Mechanical Dwg. Number
Minimum Street Width
01-5162
100 Microns
Reject Ink Dot Size
0.25mm Diameter Minimum
See Die Outline drawing below
Store in original container, in dessicated
nitrogen, with no contamination
Ink Dot Location
Recommended Storage Environment:
Reference Standard IR packaged part ( for design ) : HFA25TB60
Die Outline
NOTES :
INKDOT
LOCATION
1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES )
2. CONTROLLING DIMENSION : ( INCH )
3. LETTER DESIGNATION :
4.29
(.169 )
S = SOURCE
G = GATE
4. DIMENSIONAL TOLERANCES
BONDING PADS : < 0.635 TOLERANCE = +/- 0.013
SK = SOURCE KELVIN
IS = CURRENT SENSE
ANODE
4.30
(.1694 )
5.29
(.220 )
WIDTH
&
< (.0250 ) TOLERANCE =+/- (.0005 )
> 0.635 TOLERANCE = +/- 0.025
> (.0250 ) TOLERANCE = +/- (.0010 )
< 1.270 TOLERANCE = +/- 0.102
< (.050 ) TOLERANCE = +/- (.004 )
> 0.635 TOLERANCE = +/- 0.203
> (.050 ) TOLERANCE = +/- (.008 )
LENGTH
OVERALL DIE
WIDTH
&
2.98
(.1175 )
LENGTH
5. UNLESS OTHERWISE NOTED ALL DIE ARE GEN III