HDC3020
SNAS778 – JUNE 2021
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–55
MAX
6.0
UNIT
V
VDD
Applied Voltage on VDD pin
Applied Voltage on SCL pin
Applied Voltage on SDA pin
Applied Voltage on ADDR pin
Applied Voltage on ADDR1 pin
Applied Voltage on ALERT pin
Applied Voltage on RESET pin
Junction temperature
SCL
6.0
V
SDA
6.0
V
ADDR
ADDR1
ALERT
RESET
TJ
6.0
V
VDD + 0.3
VDD + 0.3
VDD + 0.3
150
V
V
V
°C
°C
Tstg
Storage temperature
–65
150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC
±2000
JS-001(1)
Charged device model (CDM), per JEDEC specification
V(ESD)
Electrostatic discharge
All Pins
±500
±750
V
JESD22-C101(2)
Charged device model (CDM), per JEDEC specification
JESD22-C101(2)
Corner Pins
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process
6.3 Recommended Operating Conditions
PARAMETER
MIN
1.62
–40
–20
–40
0
MAX UNIT
VDD
Supply voltage
5.5
125
70
V
TTEMP
TRH
Temperature Sensor - Operating free-air temperature
°C
°C
°C
Relative Humidity Sensor - Operating free-air temperature
Integrated Heater for condensation removal - Operating free-air temperature(1)
Relative Humidity Sensor Operating Range (Non-condensing) (1)
THEATER
RHOR
60
100 %RH
(1) Prolonged operation outside the recommended temperature operating conditions and/or at >80%RH with temperature in the higher
recommended operating range can result in a shift of sensor reading, with slow recovery time. See Exposure to High Temperature and
High Humidity Conditions for more details.
6.4 Thermal Information
HDC3x
THERMAL METRIC(1)
DEF, DEH, and DEJ
UNIT
8 PINS
84.9
N/A
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance(2)
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
52.0
N/A
ΨJT
Junction-to-top characterization parameter(2)
Copyright © 2021 Texas Instruments Incorporated
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