Datasheet > HDC2021DEBT

HDC2021DEBT

更新时间： 2023-09-03 20:30:22

品牌	Logo	应用领域
德州仪器 - TI		传感器
页数	文件大小	规格书
45页	1568K
描述
带胶带盖的 2% RH 超低功耗数字相对湿度传感器 \| DEB \| 6 \| -40 to 125

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HDC2021DEBT 数据手册

PACKAGE OUTLINE

DEB0006A

WSON - 0.92 mm max height

SCALE 4.000

PLASTIC SMALL OUTLINE - NO LEAD

3.1

2.9

(45 X 0.6)

PIN 1 INDEX AREA

3.1

2.9

(1)

PEELABLE COVER TAPE

IP66 RATED & 260 C CAPABLE

NOTE 4

(1)

3X (R0.375)

ADHESIVE FREE

SURFACE

(

2.75)

(0.32)

0.8

0.7

0.92 MAX

SEATING PLANE

0.08 C

(0.2) TYP

0.05

0.00

1.5 0.1

EXPOSED

THERMAL PAD

2.4 0.1

4X 1

0.45

0.35

0.5

0.3

PIN 1 ID

0.1

C A B

0.05

4224371/D 01/2020

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

4. IPXY Rating represents environmental ingress protection from both dust and high pressure water sprays. X=6 represents

resistance to dust and Y=6 represents high pressure water spray resistance per IEC60529 testing conditions.

www.ti.com

1...39 40 414243 44 45

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