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HD64336024XXXFT PDF预览

HD64336024XXXFT

更新时间: 2023-07-15 00:00:00
品牌 Logo 应用领域
瑞萨 - RENESAS 微控制器
页数 文件大小 规格书
384页 2498K
描述
Microcontrollers with a 32-bit H8/300H CPU core (Non Promotion), , /

HD64336024XXXFT 数据手册

 浏览型号HD64336024XXXFT的Datasheet PDF文件第1页浏览型号HD64336024XXXFT的Datasheet PDF文件第2页浏览型号HD64336024XXXFT的Datasheet PDF文件第4页浏览型号HD64336024XXXFT的Datasheet PDF文件第5页浏览型号HD64336024XXXFT的Datasheet PDF文件第6页浏览型号HD64336024XXXFT的Datasheet PDF文件第7页 
Keep safety first in your circuit designs!  
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and  
more reliable, but there is always the possibility that trouble may occur with them. Trouble with  
semiconductors may lead to personal injury, fire or property damage.  
Remember to give due consideration to safety when making your circuit designs, with appropriate  
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or  
(iii) prevention against any malfunction or mishap.  
Notes regarding these materials  
1. These materials are intended as a reference to assist our customers in the selection of the Renesas  
Technology Corp. product best suited to the customer's application; they do not convey any license  
under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or  
a third party.  
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-  
party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or  
circuit application examples contained in these materials.  
3. All information contained in these materials, including product data, diagrams, charts, programs and  
algorithms represents information on products at the time of publication of these materials, and are  
subject to change by Renesas Technology Corp. without notice due to product improvements or  
other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or  
an authorized Renesas Technology Corp. product distributor for the latest product information  
before purchasing a product listed herein.  
The information described here may contain technical inaccuracies or typographical errors.  
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising  
from these inaccuracies or errors.  
Please also pay attention to information published by Renesas Technology Corp. by various means,  
including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).  
4. When using any or all of the information contained in these materials, including product data,  
diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total  
system before making a final decision on the applicability of the information and products. Renesas  
Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the  
information contained herein.  
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or  
system that is used under circumstances in which human life is potentially at stake. Please contact  
Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when  
considering the use of a product contained herein for any specific purposes, such as apparatus or  
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.  
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in  
whole or in part these materials.  
7. If these products or technologies are subject to the Japanese export control restrictions, they must  
be exported under a license from the Japanese government and cannot be imported into a country  
other than the approved destination.  
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the  
country of destination is prohibited.  
8. Please contact Renesas Technology Corp. for further details on these materials or the products  
contained therein.  
Rev. 4.00 Sep. 23, 2005 Page iii of xxvi  

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