6
Regulatory Information
The devices contained in this data sheet have been approved by the following agencies:
Agency/Standard
HCPL-4506 HCPL-J456 HCPL-0466 HCNW4506
Underwriters Laboratories (UL)
UL 1577
Recognized under UL 1577, Component
Recognized Program, Category FPQU2,
File E55361
✔
✔
✔
✔
✔
Canadian Standards
Association (CSA)
File CA88324
Verband Deutscher
Electrotechniker (VDE)
Component
Acceptance
Notice #5
DIN VDE 0884
(June 1992)
✔
✔
✔
✔
✔
✔
Technischer
DIN VDE 0884
(June 1992)
Uberwachungs-Verein
Rheinland (TUV) Certificate R9650938
✔
British
Certification according to
Standards
Institute
(BSI)
BS EN60065: 1994(BS415:1994),
BS EN 60950: 1992(BS7002:1992),
and IEC 65(1985).
✔
Insulation and Safety Related Specifications
Value
Parameter
Symbol HCPL-4506 HCPL-J456 HCPL-0466 HCNW4506 Units
Conditions
Minimum External L(101)
Air Gap (External
Clearance)
7.1
7.4
8.0
0.5
4.9
9.6
10.0
1.0
mm Measured from input
terminals to output
terminals, shortest
distance through air.
Minimum External L(102)
Tracking (External
Creepage)
7.4
4.8
mm Measured from input
terminals to output
terminals, shortest
distance path along body.
Minimum Internal
Plastic Gap
(Internal Clearance)
0.08
0.08
mm Through insulation
distance, conductor to
conductor, usually the
direct distance between
the photoemitter and
photodetector inside the
optocoupler cavity.
Minimum Internal
Tracking (Internal
Creepage)
NA
NA
NA
4.0
mm Measured from input
terminals to output
terminals, along internal
cavity.
Tracking Resistance CTI
(Comparative
Tracing Index)
≥ 175
≥ 175
≥ 175
≥ 200
Volts DIN IEC 112/VDE 0303
Part 1
Isolation Group
IIIa
IIIa
IIIa
IIIa
Material Group (DIN
VDE 0110, 1/89, Table 1)
All Agilent data sheets report the creepage and clearance inherent to the optocoupler component itself. These
dimensions are needed as a starting point for the equipment designer when determining the circuit insulation require-
ments. However, once mounted on a printed circuit board, minimum creepage and clearance requirements must be
met as specified for individual equipment standards. For creepage, the shortest distance path along the surface of a
printed circuit board between the solder fillets of the input and output leads must be considered. There are recom-
mended techniques such as grooves and ribs which may be used on a printed circuit board to achieve desired creepage
and clearances. Creepage and clearance distances will also change depending on factors such as pollution degree and
insulation level.
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