Datasheet > HCPL-5201-300

HCPL-5201-300

更新时间： 2022-03-22 01:07:16

品牌	Logo	应用领域
惠普 - HP		光电栅
页数	文件大小	规格书
12页	296K
描述
Hermetically Sealed, Low IF, Wide VCC, Logic Gate Optocouplers

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中文翻译

获取价格

数据手册

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HCPL-5201-300 数据手册

Functional Diagrams

8 Pin DIP

Through Hole

1 Channel

8 Pin DIP

Through Hole

2 Channels

16 Pin Flat Pack

Unformed Leads

4 Channels

20 Pad LCCC

Surface Mount

2 Channels

CC2

GND

CC1

GND

GND 10

Note: Multichannel DIP and flat pack devices have common V_CCand ground. Single channel DIP has an enable pin 6. LCCC (leadless

ceramic chip carrier) package has isolated channels with separate V_CCand ground connections.

7.24 (0.285)

Outline Drawings

6.99 (0.275)

16 Pin Flat Pack, 4 Channels

2.29 (0.090)

MAX.

1.27 (0.050)

REF.

11.13 (0.438)

10.72 (0.422)

0.46 (0.018)

0.36 (0.014)

8.13 (0.320)

MAX.

2.85 (0.112)

MAX.

0.88 (0.0345)

MIN.

0.31 (0.012)

0.23 (0.009)

0.89 (0.035)

0.69 (0.027)

5.23

(0.206)

MAX.

9.02 (0.355)

8.76 (0.345)

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

20 Terminal LCCC Surface Mount, 2 Channels

8 Pin DIP Through Hole, 1 and 2 Channel

8.70 (0.342)

9.10 (0.358)

9.40 (0.370)

9.91 (0.390)

0.76 (0.030)

1.27 (0.050)

8.13 (0.320)

MAX.

4.95 (0.195)

5.21 (0.205)

1.78 (0.070)

2.03 (0.080)

7.16 (0.282)

7.57 (0.298)

1.02 (0.040) (3 PLCS)

1.14 (0.045)

1.40 (0.055)

4.32 (0.170)

MAX.

8.70 (0.342)

9.10 (0.358)

4.95 (0.195)

5.21 (0.205)

TERMINAL 1 IDENTIFIER

2.16 (0.085)

0.51 (0.020)

MIN.

3.81 (0.150)

METALIZED

CASTILLATIONS (20 PLCS)

1.78 (0.070)

2.03 (0.080)

0.20 (0.008)

0.33 (0.013)

MIN.

0.64

(0.025)

(20 PLCS)

0.51 (0.020)

1.52 (0.060)

2.03 (0.080)

7.36 (0.290)

7.87 (0.310)

2.29 (0.090)

2.79 (0.110)

0.51 (0.020)

MAX.

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

SOLDER THICKNESS 0.127 (0.005) MAX.

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

1 234 5 6 7...12

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