CHP, HCHP
High Stability Resistor Chips
(< 0.25 % at Pn at 70 °C during 1000 h)
Thick Film Technology
Vishay Sfernice
TYPICAL HF PERFORMANCE OF HCHP
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
1 Ω
1 Ω
10 Ω
10 Ω
100 Ω
200 Ω
100 Ω
200 Ω
1 kΩ
1 kΩ
10 kΩ
1 MΩ
100 kΩ
10 kΩ
1 MΩ
100 kΩ
1
10
100
1000
10 000
1
10
100
1000
10 000
Size 0603 (W/A)
f (MHz)
Size 0603 (Flip chip)
f (MHz)
POPULAR OPTIONS
For any option it is recommended to consult Vishay Sfernice for availability first.
Option: Enlarged terminations:
For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint
can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heat sinks
(see application note: 53048 Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film,
PRA Arrays, CHP Thick Film) www.vishay.com/doc?53048.
Option to order: 0063 (applies to size 1206/1505/1020/2010/2512).
DIMENSIONS (Option 0063) in millimeters
Bottom view for mounting
Uncoatted
ceramic
A
Enlarged
termination
B
F
D
E
A
B
E
D
MAX. TOL.
+ 0.152
MIN. TOL.
- 0.152
MAX. TOL.
+ 0.127
MIN. TOL.
- 0.127
MAX. TOL.
+ 0.13
MIN. TOL.
- 0.13
MAX. TOL.
+ 0.13
MIN. TOL.
- 0.13
F
CASE
SIZE
NOMINAL
3.06 (0.120)
3.81 (0.150)
2.54 (0.100)
5.08 (0.200)
6.35 (0.250)
NOMINAL
1.60 (0.063)
1.32 (0.052)
5.08 (0.200)
2.54 (0.100)
3.06 (0.120)
NOMINAL
NOMINAL
1.22 (0.048)
1.59 (0.063)
0.96 (0.038)
2.23 (0.088)
2.86 (0.11)
NOMINAL
0.63 (0.024)
0.63 (0.024)
0.63 (0.024)
0.63 (0.024)
0.63 (0.024)
MIN.
MAX.
1206
1505
1020
2010
2512
0.40 (0.016)
0.50 (0.020)
0.50 (0.020)
0.50 (0.020)
0.50 (0.020)
0.50 (0.020)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
0.48 (0.019)
Document Number: 52023
Revision: 25-Aug-09
For technical questions, contact: sfer@vishay.com
www.vishay.com
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