CHP, HCHP
High Stability Resistor Chips
(< 0.25 % at Pn at 70 °C during 1000 h)
Thick Film Technology
Vishay Sfernice
ELECTRICAL SPECIFICATIONS
PACKAGING
Resistance range:
Resistance tolerance:
Power dissipation:
0.1R to 100M
0.5 % to 10 %
Pn: 50 mW to 2 W
ESD packaging available: Waffle pack and plastic tape and
reel (low conductivity). Paper tapes available on request
(ESD only).
Temperature coefficient: K: 100 ppm/°C
NUMBER OF PIECES PER PACKAGE
TAPE
L: 200 ppm/°C
SIZE
WAFFLE
PACK
TAPE AND REEL
WIDTH
MECHANICAL SPECIFICATIONS
MIN.
MAX.
Substrate:
Alumina
Thick film (Ruthenium oxyde)
Epoxy coating
0502
0505
0603
0805
1005
1206
1505
2010
1010
2208
1020
2512
Technology:
Protection:
Terminations:
100
B (W/A): SnPb over nickel
barrier for solder reflow
N (W/A): SnAg over nickel
barrier for solder reflow
F (Flip Chip): SnAg over nickel
barrier for solder reflow
W (one face) and G (W/A) type:
gold over nickel barrier for other
applications
4000
8 mm
140
60
100
1000
4000
8 mm (2)
8 mm (2)
8 mm (2)
8 mm (2)
8 mm (2)
100
60
1000
60
45
CLIMATIC SPECIFICATIONS
Operating temp. range:
Note
(2) 12 mm on request
- 55 °C to + 155 °C
Note
• For temperature up to 215 °C please consult Vishay Sfernice
PACKAGING RULES
BEST TOL. AND TCR VERSUS OHMIC VALUE (1)
Waffle Pack
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered exceeds maximum quantity of a
single waffle pack, the waffle packs are stacked up on the top
of each other and closed by one single cover.
To get “not stacked up” waffle pack in case of ordered
quantity > maximum number of pieces per package:
Please consult Vishay Sfernice for specific ordering
code
TIGHTEST
OHMIC
BEST TCR
ppm/°C
TOLERANCE
VALUES
0.5 % (D)
1 % (F)
2 % (G)
5 % (J)
10 Ω < R < 5M
5 Ω < R < 10M
100 (K)
100 (K)
200 (L)
200 (L)
1 Ω < R < R max.
0.1 Ω < R < R max.
Note
(1) Improved performance on request
Tape and Reel
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered is between the MOQ and the
maximum reel capacity, only one reel is provided.
When several reels are needed for ordered quantity
within MOQ and maximum reel capacity: Please consult
Vishay Sfernice for specific ordering code
CHIPS FOR HIGH FREQUENCY APPLICATIONS
The HF performance of flip chip and W/A types can be
improved on request.
Please ask for HCHP
POWER DERATING CURVE
100
80
60
40
20
0
0
20
40
60 70 80
100
120
140 155
Ambient Temperature in °C
www.vishay.com
56
For technical questions, contact: sfer@vishay.com
Document Number: 52023
Revision: 25-Aug-09