Datasheet > H02N60E

H02N60E

更新时间： 2024-02-11 05:37:14

品牌	Logo	应用领域
HSMC		晶体晶体管功率场效应晶体管
页数	文件大小	规格书
6页	78K
描述
N-Channel Power Field Effect Transistor

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技术参数
数据手册

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H02N60E 技术参数

生命周期：	Obsolete	包装说明：	,
Reach Compliance Code：	unknown	风险等级：	5.84
Base Number Matches：	1

H02N60E 数据手册

Spec. No. : MOS200403

Issued Date : 2004.07.01

Revised Date : 2005.07.14

Page No. : 4/6

HI-SINCERITY

MICROELECTRONICS CORP.

TO-251 Dimension

DIM

Min.

6.35

4.80

1.30

5.40

6.75

0.50

0.40

0.90

2.20

0.40

Max.

6.80

5.50

1.70

6.25

8.00

0.90

1.50

2.40

0.65

*2.30

Marking:

Pb Free Mark

(Note)

Pb-Free: " . "

Tab

Normal: None

0 2 N 6 0

Date Code

Control Code

Note: Green label is used for pb-free packing

Pin Style: 1.Gate 2.Drain 3.Source

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

*: Typical, Unit: mm

3-Lead TO-251

Plastic Package

HSMC Package Code: I

DIM

Min.

6.40

5.04

0.40

0.50

5.90

Max.

6.80

6.00

5.64

*4.34

0.80

0.90

6.30

*1.80

*9.30

*16.10

*0.80

0.96

*0.76

2.40

0.60

2.50

5^o

Marking:

Pb Free Mark

(Note)

Pb-Free: " . "

Normal: None

0 2 N 6 0

Date Code

Control Code

Note: Green label is used for pb-free packing

Pin Style: 1.Gate 2.Drain 3.Source

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

2.20

0.40

2.10

3^o

*: Typical, Unit: mm

3-Lead TO-251

Plastic Package

HSMC Package Code: I

H02N60I, H02N60J, H02N60E, H02N60F

HSMC Product Specification

1 2 345 6

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