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GS8342D07BD-450IT PDF预览

GS8342D07BD-450IT

更新时间: 2024-01-04 13:11:37
品牌 Logo 应用领域
GSI 时钟静态存储器内存集成电路
页数 文件大小 规格书
29页 407K
描述
QDR SRAM, 4MX8, 0.45ns, CMOS, PBGA165, BGA-165

GS8342D07BD-450IT 技术参数

是否Rohs认证:不符合生命周期:Active
零件包装代码:BGA包装说明:LBGA, BGA165,11X15,40
针数:165Reach Compliance Code:compliant
ECCN代码:3A991.B.2.BHTS代码:8542.32.00.41
风险等级:5.19Is Samacsys:N
最长访问时间:0.45 ns其他特性:PIPELINED ARCHITECTURE
最大时钟频率 (fCLK):450 MHzI/O 类型:SEPARATE
JESD-30 代码:R-PBGA-B165长度:15 mm
内存密度:33554432 bit内存集成电路类型:QDR SRAM
内存宽度:8功能数量:1
端子数量:165字数:4194304 words
字数代码:4000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:4MX8输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:LBGA
封装等效代码:BGA165,11X15,40封装形状:RECTANGULAR
封装形式:GRID ARRAY, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED电源:1.5/1.8,1.8 V
认证状态:Not Qualified座面最大高度:1.4 mm
最大待机电流:0.25 A最小待机电流:1.7 V
子类别:SRAMs最大压摆率:0.795 mA
最大供电电压 (Vsup):1.9 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:13 mmBase Number Matches:1

GS8342D07BD-450IT 数据手册

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GS8342D07/10/19/37BD-450/400/350/333/300  
450 MHz–300 MHz  
36Mb SigmaQuad-II+TM  
Burst of 4 SRAM  
165-Bump BGA  
Commercial Temp  
Industrial Temp  
1.8 V V  
DD  
1.8 V and 1.5 V I/O  
are just one element in a family of low power, low voltage  
HSTL I/O SRAMs designed to operate at the speeds needed to  
implement economical high performance networking systems.  
Features  
• 2.0 Clock Latency  
• Simultaneous Read and Write SigmaQuad™ Interface  
• JEDEC-standard pinout and package  
• Dual Double Data Rate interface  
• Byte Write controls sampled at data-in time  
• Burst of 4 Read and Write  
• On-Die Termination (ODT) on Data (D), Byte Write (BW),  
and Clock (K, K) inputs  
• 1.8 V +100/–100 mV core power supply  
• 1.5 V or 1.8 V HSTL Interface  
Clocking and Addressing Schemes  
The GS8342D07/10/19/37BD SigmaQuad-II+ SRAMs are  
synchronous devices. They employ two input register clock  
inputs, K and K. K and K are independent single-ended clock  
inputs, not differential inputs to a single differential clock input  
buffer.  
• Pipelined read operation  
• Fully coherent read and write pipelines  
• ZQ pin for programmable output drive strength  
• Data Valid Pin (QVLD) Support  
• IEEE 1149.1 JTAG-compliant Boundary Scan  
• 165-bump, 13 mm x 15 mm, 1 mm bump pitch BGA package  
• RoHS-compliant 165-bump BGA package available  
Each internal read and write operation in a SigmaQuad-II+ B4  
RAM is four times wider than the device I/O bus. An input  
data bus de-multiplexer is used to accumulate incoming data  
before it is simultaneously written to the memory array. An  
output data multiplexer is used to capture the data produced  
from a single memory array read and then route it to the  
appropriate output drivers as needed. Therefore the address  
field of a SigmaQuad-II+ B4 RAM is always two address pins  
less than the advertised index depth (e.g., the 4M x 8 has a 1M  
addressable index).  
SigmaQuadFamily Overview  
The GS8342D07/10/19/37BD are built in compliance with the  
SigmaQuad-II+ SRAM pinout standard for Separate I/O  
synchronous SRAMs. They are 37,748,736-bit (36Mb)  
SRAMs. The GS8342D07/10/19/37BD SigmaQuad SRAMs  
Parameter Synopsis  
-450  
-400  
2.5 ns  
0.45 ns  
-350  
2.86 ns  
0.45 ns  
-333  
-300  
tKHKH  
tKHQV  
2.22 ns  
0.45 ns  
3.0 ns  
0.45 ns  
3.3 ns  
0.45 ns  
Rev: 1.02 6/2012  
1/29  
© 2011, GSI Technology  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  

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