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GS8320ZV18GT-133IT PDF预览

GS8320ZV18GT-133IT

更新时间: 2024-01-29 01:32:27
品牌 Logo 应用领域
GSI 静态存储器内存集成电路
页数 文件大小 规格书
23页 629K
描述
ZBT SRAM, 2MX18, 8.5ns, CMOS, PQFP100, LEAD FREE, TQFP-100

GS8320ZV18GT-133IT 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:QFP
包装说明:LQFP,针数:100
Reach Compliance Code:compliantECCN代码:3A991.B.2.B
HTS代码:8542.32.00.41风险等级:5.84
最长访问时间:8.5 ns其他特性:FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 代码:R-PQFP-G100JESD-609代码:e3
长度:20 mm内存密度:37748736 bit
内存集成电路类型:ZBT SRAM内存宽度:18
湿度敏感等级:3功能数量:1
端子数量:100字数:2097152 words
字数代码:2000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:2MX18封装主体材料:PLASTIC/EPOXY
封装代码:LQFP封装形状:RECTANGULAR
封装形式:FLATPACK, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):260认证状态:Not Qualified
座面最大高度:1.6 mm最大供电电压 (Vsup):2 V
最小供电电压 (Vsup):1.6 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:PURE MATTE TIN
端子形式:GULL WING端子节距:0.65 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:14 mmBase Number Matches:1

GS8320ZV18GT-133IT 数据手册

 浏览型号GS8320ZV18GT-133IT的Datasheet PDF文件第2页浏览型号GS8320ZV18GT-133IT的Datasheet PDF文件第3页浏览型号GS8320ZV18GT-133IT的Datasheet PDF文件第4页浏览型号GS8320ZV18GT-133IT的Datasheet PDF文件第5页浏览型号GS8320ZV18GT-133IT的Datasheet PDF文件第6页浏览型号GS8320ZV18GT-133IT的Datasheet PDF文件第7页 
Preliminary  
GS8320ZV18/36T-250/225/200/166/150/133  
250 MHz133 MHz  
100-Pin TQFP  
Commercial Temp  
Industrial Temp  
36Mb Pipelined and Flow Through  
Synchronous NBT SRAMs  
1.8 V V  
DD  
1.8 V I/O  
Because it is a synchronous device, address, data inputs, and  
Features  
read/ write control inputs are captured on the rising edge of the  
input clock. Burst order control (LBO) must be tied to a power  
rail for proper operation. Asynchronous inputs include the  
Sleep mode enable (ZZ) and Output Enable. Output Enable can  
be used to override the synchronous control of the output  
drivers and turn the RAM's output drivers off at any time.  
Write cycles are internally self-timed and initiated by the rising  
edge of the clock input. This feature eliminates complex off-  
chip write pulse generation required by asynchronous SRAMs  
and simplifies input signal timing.  
• NBT (No Bus Turn Around) functionality allows zero wait  
read-write-read bus utilization; Fully pin-compatible with  
both pipelined and flow through NtRAM™, NoBL™ and  
ZBT™ SRAMs  
• 1.8 V +10%/10% core power supply  
• 1.8 V I/O supply  
• User-configurable Pipeline and Flow Through mode  
• LBO pin for Linear or Interleave Burst mode  
• Pin compatible with 2Mb, 4Mb, 8Mb, and 16Mb devices  
• Byte write operation (9-bit Bytes)  
• 3 chip enable signals for easy depth expansion  
• ZZ Pin for automatic power-down  
• JEDEC-standard 100-lead TQFP package  
• Pb-Free 100-lead TQFP package available  
The GS8320ZV18/36T may be configured by the user to  
operate in Pipeline or Flow Through mode. Operating as a  
pipelined synchronous device, meaning that in addition to the  
rising edge triggered registers that capture input signals, the  
device incorporates a rising-edge-triggered output register. For  
read cycles, pipelined SRAM output data is temporarily stored  
by the edge triggered output register during the access cycle  
and then released to the output drivers at the next rising edge of  
clock.  
Functional Description  
The GS8320ZV18/36T is a 36Mbit Synchronous Static  
SRAM. GSI's NBT SRAMs, like ZBT, NtRAM, NoBL or  
other pipelined read/double late write or flow through read/  
single late write SRAMs, allow utilization of all available bus  
bandwidth by eliminating the need to insert deselect cycles  
when the device is switched from read to write cycles.  
The GS8320ZV18/36T is implemented with GSI's high  
performance CMOS technology and is available in a JEDEC-  
standard 100-pin TQFP package.  
Parameter Synopsis  
-250 -225 -200 -166 -150 -133 Unit  
t
2.5 2.7 3.0 3.5 3.8 4.0 ns  
4.0 4.4 5.0 6.0 6.6 7.5 ns  
KQ  
Pipeline  
3-1-1-1  
tCycle  
Curr (x18) 285 265 245 220 210 185 mA  
Curr (x32/x36) 350 320 295 260 240 215 mA  
t
6.5 7.0 7.5 8.0 8.5 8.5 ns  
6.5 7.0 7.5 8.0 8.5 8.5 ns  
KQ  
Flow  
Through  
2-1-1-1  
tCycle  
Curr (x18) 205 195 185 175 165 155 mA  
Curr (x32/x36) 235 225 210 200 190 175 mA  
Rev: 1.01 10/2004  
1/23  
© 2001, GSI Technology  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  

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