GS81313LD18/36GK-833/714/625
Revision History
Rev. Code
Types of Changes
Format or Content
Revisions
GS81313LD1836GK_r1.05
GS81313LD1836GK_r1.06
GS81313LD1836GK_r1.07
—
• Initial public release.
Content
Content
• Removed leaded BGA package support.
• Miscellaneous cleanup.
• Increased V (max) to 1.35V.
DD
• Added package thermal impedances.
• Added t
(max) specs.
KHKH
• Revised t
• Revised t
• Revised t
specs.
GS81313LD1836GK_r1.08
Content
KHKDH
, t
, and t
specs.
KHCQH
KHQV KHQX
and t
specs.
CQHQX
CQHQV
• Banner changed to “Preliminary”, to reflect ES status.
• Updated speed bins to -833, -714, and -625.
• Added input pulse width specs.
GS81313LD1836GK_r1.09
Content
• Added I specifications.
GS81313LD1836GK_r1.10
GS81313LD1836GK_r1.11
Content
Content
DD
• Removed “Preliminary” from data sheets.
• Increased V (min) to 1.2V for 625 MHz speed bin. V (min) is
DD
DD
GS81313LD1836GK_r1.12
GS81313LD1836GK_r1.13
Content
Content
now the same value for all speed bins.
• A 2K resistor connected between RCS and V is now required;
SS
previously, it was optional.
Rev: 1.13 7/2016
26/26
© 2014, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.