Datasheet > GRM31A5C2H300JW01

GRM31A5C2H300JW01

更新时间： 2022-02-26 09:29:02

品牌	Logo	应用领域
村田 - MURATA		/
页数	文件大小	规格书
28页	1160K
描述
Chip Multilayer Ceramic Capacitors for General Purpose

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Complement of Test Method

1.Test substrate

The test substrate should be Substrate A or Substrate B as described in “Specifications and Test methods”.

The specimen should be soldered by the conditions as described below.

Soldering Method : Reflow soldering

Solder : Sn-3.0Ag-0.5Cu

(1) Test Substrate A

･Land Dimensions

Chip Capacitor

Dimension (mm)

Type

Land

GRM18

GRM21

GRM31

GRM32

GRM42

GRM43

GRM52

GRM55

1.0

1.2

2.2

3.5

4.5

3.0

4.0

5.0

7.0

8.0

1.2

1.65

2.0

2.9

2.4

3.7

3.2

5.6

Solder Resist

･Material : Glass Epoxy Board

･Thickness : 1.6mm

･Thickness of copper foil : 0.035mm

(1) Test Substrate B

Dimension of pettern (mm)

Type

GRM18

GRM21

GRM31

GRM32

GRM42

GRM43

GRM52

GRM55

1.0

1.2

2.2

3.5

4.5

3.0

4.0

5.0

7.0

8.0

1.2

1.65

2.0

2.9

2.4

3.7

3.2

5.6

1.0

(f4.5)

1.6

100

Copper foil

Solder resist

(unit : mm)

･Material : Glass Epoxy Board

･Thickness of copper foil : 0.035mm

2. Test Method of Substrate Bending test

a) Support state

(b) Test state

Test Substrate B

Capacitor

Support stand(f5)

45+/-2

Pressure stick

Test stand

Support stand

(unit : mm)

a:+/-2 gap between support stand center and test stand

·Material of Test stand and pressure stick

ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀb:+/-5 gap between support stand center and test stand center

ꢀꢀꢀꢀꢀThe material shoud be a metal where a remarkable transformation and the distortion are not caused even if it is pressurized.

·Pressurizing speed

ꢀꢀꢀꢀꢀThe pressurizing speed is pressurized at the speed of about 1mm/s until the flexure reaches a regulated value.

Pressure stick

ꢀꢀꢀꢀꢀ

Support

stand

JEMCGS-04233D

1 2 345 6 7...28

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