Datasheet > GRM1885C2A3R9WA01D

GRM1885C2A3R9WA01D

更新时间： 2022-02-26 10:39:28

品牌	Logo	应用领域
村田 - MURATA		/
页数	文件大小	规格书
30页	782K
描述
Chip Multilayer Ceramic Capacitors for General Purpose

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GRM1885C2A3R9WA01D 数据手册

3. Board Design

When designing the board, keep in mind that the amount of strain which occurs will increase

ꢀ depending on the sizeand material of the board.

Relationship with amount of strain to the board thickness, length, width, etc.]

3PL

Relationshipbetweenloadandstrain

ε=

2Ewh²

ε：Strain on center of board (μst)

L：Distance between supporting points (mm)

：Board width (mm)

：Board thickness (mm)

：Elastic modulus of board (N/m²=Pa)

：Deflection (mm)

：Load (N)

When the load is constant, the following relationship can be established.

· As the distance between the supporting points (L) increases,the amount of strain also increases.

→Reduce the distance between the supporting points.

· As the elastic modulus (E) decreases, the amount of strain increases.

→Increase the elastic modulus.

As the board width (w) decreases, the amount of strain increases.

→Increase the width of the board.

As the board thickness (h) decreases, the amount of strain increases.

→Increase the thickness of the board.

Since the board thickness is squared, the effect on the amount of strain becomes even greater.

GRM1885C2A3R9WA01-01A

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