Datasheet > GRM1881X1H271JA01D

GRM1881X1H271JA01D

更新时间： 2022-12-29 20:50:27

品牌	Logo	应用领域
村田 - MURATA		/
页数	文件大小	规格书
30页	783K
描述
Chip Multilayer Ceramic Capacitors for General Purpose

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Substrate Bending Test

・Test Substrate

Material : JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)

Thickness :

1.6mm

Copper Foil Thickness: 0.035mm

Kind of Solder : Sn-3.0Ag-0.5Cu

Land

4.5

Dimension(mm)

Series

GRM18

1.0

3.0

1.2

100

Solder Resist (Coat with heat resistant resin for solder)

Fig.1 (in mm)

・Pressurization Method

50min.

Pressurization speed

1.0mm/s

Pressurize

Flexure

Capacitance meter

Fig.2 (in mm)

Adhesive Strength of Termination, Vibration, Temperature Sudden Change, High Temperature High Humidity(Steady), Durability

・Test Substrate

Material : JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)

Thickness :

1.6mm or 0.8mm

Copper Foil Thickness: 0.035mm

Kind of Solder : Sn-3.0Ag-0.5Cu

・Land Dimensions

Chip Capacitor

Land

Dimension(mm)

Series

GRM18

1.0

3.0

1.2

Solder Resist

Fig.3

GRM1887U1A273JA01-01A

1 2 3 456 7 8...30

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