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GPC5643LF2MLQ1 PDF预览

GPC5643LF2MLQ1

更新时间: 2024-03-03 10:07:49
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
136页 1175K
描述
NXP 32-bit MCU, Dual Power Arch, 1MB Flash, 120MHz, -40/+125degC, Automotive Grade, QFP 144

GPC5643LF2MLQ1 数据手册

 浏览型号GPC5643LF2MLQ1的Datasheet PDF文件第129页浏览型号GPC5643LF2MLQ1的Datasheet PDF文件第130页浏览型号GPC5643LF2MLQ1的Datasheet PDF文件第131页浏览型号GPC5643LF2MLQ1的Datasheet PDF文件第133页浏览型号GPC5643LF2MLQ1的Datasheet PDF文件第134页浏览型号GPC5643LF2MLQ1的Datasheet PDF文件第135页 
Document revision history  
Table 41. Revision history (continued)  
Description of changes  
Revision  
Date  
8
27 April 2012 Editorial changes.  
In the “Device comparison” section, changed “Ambient temperature range using external  
ballast transistor (BGA)“ from TBD to “–40 to 125 °C“.  
In the “Block diagram” section, removed one PMU from the figure.  
In the 257-pin pinout figure, changed cut2 to cut2/3 in Notes.  
In the pin function summary table, changed cut2 to cut2/3.  
In the “System pins” table:  
• Added Note regarding Open Drain Enable.  
• Added description to RESET pin.  
In the pin-muxing table:  
• Added Note about Open Drain.  
• Changed cut2 to cut2/3.  
• Changed all entries of column 'Weak pull config during reset’ to ' - ' , except for PCR[2],  
PCR[3], PCR[4] and PCR[21].  
In the “Absolute maximum ratings” table:  
• Removed the “VSS_HV_REG” row.  
• Added the footnote “Internal structures hold the input voltage...to the VIN maximum  
specifications.  
In the “ conditions” table, removed the “VSS_HV_REG” row.  
In the “Thermal characteristics” section:  
• Added the “Thermal characteristics for 100 LQFP package“ table.  
• Updated values and footnote 1 in the 144 package table.  
• Updated footnote 1 in the 257 package table.  
In the “Supply current characteristics“ table:  
• Added footnote 1 to parameter “IDD_LV_TYP + IDD_LV_PLL“ (symbol “T”).  
• Changed “IDD_LV_STOP” at 150C from 80mA to 72mA.  
• Changed “IDD_LV_HALT” at 150C from 72mA to 80mA.  
In the “FMPLL electrical characteristics” table:  
• Deleted the footnote “This value is true when operating at frequencies above 60 MHz...”  
from the specification for fCS and fDS  
.
• Changed “fSYS” to “fFMPLLOUT” in the entries for the CJITTER, fLCK, fUL, fCS, and fDS  
specifications.  
In the “ADC conversion characteristics” table:  
• Revised the entry for TUEIS1WINJ (was P/T and “Total unadjusted error for IS1WINJ”, is  
T and “Total unadjusted error for IS1WINJ (single ADC channels)”).  
• Revised the entry for TUEIS1WWINJ (was “Total unadjusted error for IS1WWINJ”, is  
Total unadjusted error for IS1WWINJ (double ADC channels)”).  
In the “Temperature sensor electrical characteristics“ table, for TJ = TA to 125 °C, changed  
Min/Max from values -7/+7 to -10/+10.  
In the “Input Impedance and ADC Accuracy“ section:  
• Changed CS in the text from 3 pF to 7.5 pF.  
• Changed Req in the text from 330 kΩ to 133 kΩ.  
• Removed RL, RSW, and RAD from the external network design constraint equation and  
the sentence immediately preceding it.  
• Changed the CF constraint value equation constant from 2048 to 8192.  
• In the “ADC conversion characteristics“ table, changed INL Min/Max values from -2/+2  
to -3/+3.  
MPC5643L Microcontroller Data Sheet, Rev. 10  
132  
NXP Semiconductors  

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