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GNM214R60J105ME17 PDF预览

GNM214R60J105ME17

更新时间: 2024-01-06 09:30:45
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村田 - MURATA /
页数 文件大小 规格书
24页 668K
描述
CHIP MONOLITHIC CERAMIC CAPACITOR, CAPACITOR ARRAYS FOR GENERAL

GNM214R60J105ME17 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:CHIP,
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8532.25.00.45风险等级:5.82
电容:1 µF电容器类型:ARRAY/NETWORK CAPACITOR
JESD-609代码:e3长度:2 mm
安装特点:SURFACE MOUNT负容差:20%
网络类型:ISOLATED C NETWORK元件数量:1
功能数量:4端子数量:8
最高工作温度:85 °C最低工作温度:-55 °C
封装代码:CHIP封装形状:RECTANGULAR PACKAGE
包装方法:TR, PAPER, 13 INCH正容差:20%
额定(直流)电压(URdc):6.3 V座面最大高度:0.85 mm
表面贴装:YES温度特性代码:X5R
温度系数:15% ppm/ °C端子面层:Tin (Sn)
端子节距:0.5 mm端子形状:WRAPAROUND
宽度:1.25 mmBase Number Matches:1

GNM214R60J105ME17 数据手册

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SPECIFICATIONS AND TEST METHODS  
No  
1
Item  
Operating  
High Dielectric Type  
B1,F1,B3 :-25to 85℃  
Test Method  
Standard Temperature : 20℃  
(R6 : 25)  
Temperature Range  
R6 :-55to 85℃  
2
Rated Voltage  
See the previous pages.  
The rated voltage is defined as the maximum voltage which may  
be applied continuously to the capacitor.  
When AC voltage is superimposed on DC voltage, VP-P or VO-P, whichever  
is larger, should be maintained within the rated voltage range.  
3
Appearance  
No defects or abnormalities.  
Visual inspection.  
Using calipers.  
4
5
Dimension  
Within the specified dimensions.  
No defects or abnormalities.  
Dielectric Strength  
No failure should be observed when 250% of the rated voltage is  
applied between the terminations for 1 to 5 seconds,  
provided the charge/discharge current is less than 50mA.  
6
Insulation  
More than 50Ω F  
The insulation resistance should be measured with a DC voltage  
not exceeding the rated voltage at 20/25and 75%RH max.  
and within 1 minutes of charging, provided the charge/discharge  
current is less than 50mA.  
Resistance  
7
Capacitance  
Within the specified tolerance.  
The capacitance Q/D.F. should be measured at 20/25at the frequency  
and voltage shown in the table.  
8
Q/Dissipation  
Factor (D.F.)  
B1,B3,R6 : 0.1max  
F1 : 0.2max  
Capacitance  
C10μF  
(10V min)  
C10μF  
(6.3V max)  
Frequency  
Voltage  
* Table 1  
1±0.1kHz  
*1 1.0±0.2Vrms  
GNM0M2 B3/R6
 
1A/1C 104  
GNM1M2  
GNM1M2 B3/R6  
1±0.1kHz  
120±24Hz  
*2 0.5±0.1Vrms  
0.5±0.1Vrms  
B3  
1A  
1A  
224/474  
105  
C>10μF  
GNM214 B3/R6 1A  
224  
*1 For items in Table 1:Measuring Voltage : 0.5±0.1Vrms  
*2 GNM0M2 B3/R6 0J 103/223/473:  
* Table 2  
GNM0M2 B3/R6 0J/1A/1C  
103/223/473/104  
Measuring Voltage : 1.0±0.2Vrms  
GNM1M2 B3/R6  
GNM212 B3/R6  
GNM212 R6  
GNM214 B3/R6  
GNM214 B3  
0J  
1A  
225  
225  
225  
224  
225  
GNM214B30J105, GNM214R60J105,GNM212R60J225:  
Measuring Voltage : 1.0±0.1Vrms  
0J  
0J/1A  
0J  
*3 However 0.125 max. about Table 2 items.  
9
Capacitance  
Temperature  
Characteristics  
No bias B1,B3 : Within ±10%  
(-25to +85)  
The capacitance change should be measured after 5min. at each  
specified temp.stage.  
R6 : Within ±15%  
(-55to +85)  
F1 : Within +30/-80%  
(-25to +85)  
The ranges of capacitance change compared with the 20°C  
value over the temperature ranges shown in the table should  
be within the specified ranges.*  
In case of applying voltage, the capacitance change should  
be measured after 1 more min. with applying voltage in  
equilibration of each temp. stage.  
GNM0M2B30G105 only:0.2+/-0.05Vrms  
Applying  
Voltage(V)  
Step  
Temperature(C)  
20±2/25±2  
1
2
3
50% of  
B1 : Within +10/-30%  
-55±3(for R6)/  
-25±3(for B1,B3,F1)  
the rated F1 : Within +30/-95%  
voltage  
No bias  
20±2/25±2  
4
5
6
7
8
85±3(for B1,B3,R6,F1)  
20±2  
-25±3(for B1,F1)  
20±2  
50% of the  
rated voltage  
85±3(for B1,F1)  
* Initial measurement  
Perform a heat treatment at 150 +0/-10°C for one hour and then set  
for 24±2 hours at room temperature.  
Perform the initial measure-ment.  
10 Adhesive Strength  
No removal of the terminations or other defect  
should occur.  
Solder the capacitor on the test jig (glass epoxy board)shown in  
Fig.3 using a eutectic solder. Then apply 5N* force in parallel  
with the test jig for 10±1sec.  
of Termination  
The soldering should be done either with an iron or using the  
reflow method and should be conducted with care so that the  
soldering is uniform and free of defects such as heat shock.  
*2N(GNM0M2)  
JEMCCS-0013M  
2

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