Datasheet > GG0402051R5L2P

GG0402051R5L2P

更新时间： 2023-09-23 06:54:24

品牌	Logo	应用领域
京瓷/艾维克斯 - KYOCERA AVX		电视
页数	文件大小	规格书
8页	894K
描述
GiGuard High Speed TVS

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GG0402051R5L2P 数据手册

GiGuard - ESD Protection for High Speed Circuits

TEMPERATURE DERATING

DIMENSIONS

RECOMMENDED REFLOW SOLDER PAD

mm (inches)

Size

Length (L)

Width (W)

Thick (T)

Termination (t)

Size

0.60 0.03

0.30 0.03

0.15 0.05

0.25 0.05

0.30 0.05

0.80 0.15

0.275 0.025

0201

(0.024 0.001) (0.012 0.001) (0.012 0.001) (0.006 0.002)

1.00 0.05 0.60 0.05 0.50 0.05 0.20 0.05

(0.039 0.002) (0.024 0.002) (0.020 0.002) (0.008 0.002)

(0.010 0.002) (0.012 0.002) (0.031 0.006) (0.011 0.001)

0.61 0.05 0.51 0.05 1.70 0.05 0.51 0.05

(0.024 0.002) (0.020 0.002) (0.067 0.002) (0.020 0.002)

0402

RECOMMENDED SOLDER REFLOW PROFILES

RECOMMENDED SOLDERING CONDITION 1

(1) Solder: 0.12~0.18mm Thread solder (Sn96.5:Ag3.5) with

soldering flux in the core Rosin-based and non-activated

flux is recommended.

(2) Preheating: The Devices shall be preheated so that

Temperature Gradient between the devices and the tip of

soldering iron is 150℃ or below.

(3) Soldering Iron: Rated Power of 20w max with 3mm

soldering tip in diameter. Temperature of soldering iron tip

300ºCmax, 3-5sec (The required amount of solder shall be

melted in advance on the soldering tip.)

Recommended Reflow Profiles

275

Pb Free Recommended

250

225

200

175

150

125

100

Pb Free Max with care

Sn Pb Recommended

(4) Cooling: After soldering. The Devices shall be cooled

20 40

80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400 420

gradually at room ambient temperature.

Time / secs

Hand Soldering Cautions

RECOMMENDED SOLDERING CONDITION 2 –

WITHOUT PREHEATING

(1) Temperature of soldering iron tip 300℃max, 3-5sec.

(2) Solder iron tip shall not directly touch to Devices.

In hand soldering of the Devices. Large temperature gradient

between preheated the Devices and the tip of soldering iron

may cause electrical failures and mechanical damages such as

cracking or breaking of the devices. The soldering shall be

carefully controlled and carried out so that the temperature

gradient is kept minimum with following recommended

conditions for hand soldering.

(3) Solder iron tip shall be fully preheated before soldering while

soldering iron tip to the external electrode of Devices.

020217

1...3 4 567 8

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