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GDQ2A8AA-CE PDF预览

GDQ2A8AA-CE

更新时间: 2023-12-06 20:00:57
品牌 Logo 应用领域
兆易创新 - GIGADEVICE 电子通信驱动动态存储器双倍数据速率
页数 文件大小 规格书
100页 2670K
描述
近年来,随着生活娱乐、车载影音、网络通信、智慧家庭等各种消费类电子应用的蓬勃发展,利基型DDR4接口的DRAM需求迅猛上升,未来更多新兴应用和产品的诞生,将进一步驱动市场对利基型DDR4的需求。兆

GDQ2A8AA-CE 数据手册

 浏览型号GDQ2A8AA-CE的Datasheet PDF文件第1页浏览型号GDQ2A8AA-CE的Datasheet PDF文件第3页浏览型号GDQ2A8AA-CE的Datasheet PDF文件第4页浏览型号GDQ2A8AA-CE的Datasheet PDF文件第5页浏览型号GDQ2A8AA-CE的Datasheet PDF文件第6页浏览型号GDQ2A8AA-CE的Datasheet PDF文件第7页 
DDR4 SDRAM  
GDQ2A8AA  
Contents  
1
2
FEATURES ...........................................................................................................................................................5  
1.1  
1.2  
Speed Bins ....................................................................................................................................................6  
Address Table................................................................................................................................................6  
ORDERING INFORMATION.................................................................................................................................7  
2.1  
2.2  
Part Number Decoding..................................................................................................................................7  
Valid Part Numbers .......................................................................................................................................8  
3
4
PACKAGE INFORMATION ..................................................................................................................................9  
3.1  
Package 78-Ball FBGA (x8) ..........................................................................................................................9  
BALL ASSIGNMENTS .......................................................................................................................................10  
4.1  
4.2  
78-Ball FBGA (x8) Ball Assignments...........................................................................................................10  
Ball Description............................................................................................................................................11  
5
6
FUNCTIONAL BLOCK DIAGRAM.....................................................................................................................14  
ABSOLUTE MAXIMUM RATINGS.....................................................................................................................15  
6.1  
Absolute Maximum DC Ratings...................................................................................................................15  
Recommended Supply Operating Conditions .............................................................................................15  
DRAM Component Operating Temperature Range ....................................................................................15  
6.2  
6.3  
7
AC AND DC INPUT MEASUREMENT LEVELS................................................................................................17  
7.1  
AC and DC Logic Input Levels for Single-ended Signals............................................................................17  
AC and DC Logic Input Measurement Levels: VREF Tolerances .................................................................18  
AC and DC Logic Input Levels for Differential Signals................................................................................18  
7.2  
7.3  
7.3.1 AC and DC Logic Input Levels for Differential Signals ............................................................................18  
7.3.2 Differential Swing Requirements for Clock (CK_t - CK_c) ......................................................................19  
7.3.3 Differential Swing Requirements for Clock (CK_t - CK_c) ......................................................................20  
7.3.4 Address, Command, and Control Overshoot/Undershoot Specifications ...............................................21  
7.3.5 Clock Overshoot/Undershoot Specifications ...........................................................................................22  
7.3.6 Data, Strobe and Mask Overshoot/Undershoot Specifications ...............................................................23  
7.4  
Slew Rate Definitions for Differential Input Signals.....................................................................................24  
7.4.1 Slew Rate Definitions for Differential Input Signals .................................................................................24  
7.4.2 Slew Rate Definitions for Single-ended Input Signals (CMD/ADD).........................................................24  
7.5  
CK Differential Input Cross Point Voltage ...................................................................................................25  
CMOS Rail to Rail Input Levels for RESET_n.............................................................................................26  
AC and DC Logic Input Levels for DQS Signals .........................................................................................27  
7.6  
7.7  
7.7.1 Differential Signal Definition.....................................................................................................................27  
7.7.2 Differential Swing Requirements for DQS (DQS_t - DQS_c)..................................................................27  
7.7.3 Peak Voltage Calculation Method............................................................................................................28  
DS-00855-GDQ2A8AA-Rev1.4  
2
2023/6/25  

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