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GD32E503RET6

更新时间: 2023-12-06 20:01:07
品牌 Logo 应用领域
兆易创新 - GIGADEVICE /
页数 文件大小 规格书
105页 2914K
描述
Arm Cortex-M33

GD32E503RET6 数据手册

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GD32E503xxDatasheet  
List of Tables  
Table 2-1. GD32E503xx devices features and peripheral list.................................................................. 8  
Table 2-2. GD32E503xx memory map...................................................................................................... 13  
Table 2-3. GD32E503Zx LQFP144 pin definitions................................................................................... 18  
Table 2-4. GD32E503Vx LQFP100 pin definitions .................................................................................. 28  
Table 2-5. GD32E503Rx LQFP64 pin definitions .................................................................................... 35  
Table 2-6. GD32E503Cx LQFP48 pin definitions .................................................................................... 40  
Table 4-1. Absolute maximum ratings(1)(4) ............................................................................................... 54  
Table 4-2. DC operating conditions ......................................................................................................... 54  
Table 4-3. Clock frequency(1) .................................................................................................................... 55  
Table 4-4. Operating conditions at Power up/ Power down(1) ............................................................... 55  
Table 4-5. Start-up timings of Operating conditions(1)(2)(3) ..................................................................... 55  
Table 4-6. Power saving mode wakeup timings characteristics(1)(2)..................................................... 56  
Table 4-7. Power consumption characteristics(2)(3)(4)(5) .......................................................................... 56  
Table 4-8. EMS characteristics(1).............................................................................................................. 62  
Table 4-9. EMI characteristics(1) ............................................................................................................... 63  
Table 4-10. Power supply supervisor characteristics............................................................................ 63  
Table 4-11. ESD characteristics(1) ............................................................................................................ 64  
Table 4-12. Static latch-up characteristics(1)........................................................................................... 64  
Table 4-13. High speed external clock (HXTAL) generated from a crystal/ceramic characteristics. 64  
Table 4-14. High speed external clock characteristics (HXTAL in bypass mode).............................. 65  
Table 4-15. Low speed external clock (LXTAL) generated from a crystal/ceramic characteristics.. 65  
Table 4-16. Low speed external user clock characteristics (LXTAL in bypass mode)....................... 66  
Table 4-17. High speed internal clock (IRC8M) characteristics ............................................................ 67  
Table 4-18. Low speed internal clock (IRC40K) characteristics ........................................................... 67  
Table 4-19. High speed internal clock (IRC48M) characteristics.......................................................... 68  
Table 4-20. PLL characteristics................................................................................................................ 68  
Table 4-21. PLL1 characteristics.............................................................................................................. 69  
Table 4-22. PLL2 characteristics.............................................................................................................. 69  
Table 4-23. PLLUSB characteristics ........................................................................................................ 69  
Table 4-24. PLL spread spectrum clock generation (SSCG) characteristics(1) ................................... 69  
Table 4-25. Flash memory characteristics.............................................................................................. 70  
Table 4-26. NRST pin characteristics ...................................................................................................... 70  
Table 4-27. I/O port DC characteristics(1)(3).............................................................................................. 71  
Table 4-28. I/O port AC characteristics(1)(2).............................................................................................. 71  
Table 4-29. Temperature sensor characteristics(1)................................................................................. 72  
Table 4-30. ADC characteristics............................................................................................................... 72  
Table 4-31. ADC RAIN max for fADC = 35 MHz............................................................................................ 73  
Table 4-32. ADC dynamic accuracy at fADC = 14 MHz VDDA = 1.8 V(1)..................................................... 73  
Table 4-33. ADC dynamic accuracy at fADC = 35 MHz VDDA = 3.3 V(1)..................................................... 74  
Table 4-34. ADC dynamic accuracy at fADC = 35 MHz VDDA = 2.4 V(1)..................................................... 74  
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