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GD25LB512ME PDF预览

GD25LB512ME

更新时间: 2023-12-06 20:02:44
品牌 Logo 应用领域
兆易创新 - GIGADEVICE /
页数 文件大小 规格书
82页 2361K
描述
兆易创新SPI Nor Flash和SPI NAND Flash可以提供WLCSP封装(Wafer Level Chip Scale Packaging)。不同于传统塑封封装,WLCSP是一种晶圆

GD25LB512ME 数据手册

 浏览型号GD25LB512ME的Datasheet PDF文件第1页浏览型号GD25LB512ME的Datasheet PDF文件第2页浏览型号GD25LB512ME的Datasheet PDF文件第4页浏览型号GD25LB512ME的Datasheet PDF文件第5页浏览型号GD25LB512ME的Datasheet PDF文件第6页浏览型号GD25LB512ME的Datasheet PDF文件第7页 
Uniform Sector  
Standard and Quad Serial Flash  
GD25LB512ME  
8.18 PAGE PROGRAM (PP) (02H/12H)............................................................................................................................ 42  
8.19 QUAD PAGE PROGRAM (32H/34H).......................................................................................................................... 43  
8.20 EXTEND QUAD PAGE PROGRAM (C2H/3EH) .............................................................................................................. 44  
8.21 SECTOR ERASE (SE) (20H/21H)............................................................................................................................... 45  
8.22 32KB BLOCK ERASE (BE32) (52H/5CH)................................................................................................................... 46  
8.23 64KB BLOCK ERASE (BE) (D8H/DCH)...................................................................................................................... 47  
8.24 CHIP ERASE (CE) (60H/C7H) .................................................................................................................................. 47  
8.25 ENABLE QPI (38H) ................................................................................................................................................ 48  
8.26 DISABLE QPI (FFH) ................................................................................................................................................ 48  
8.27 DEEP POWER-DOWN (DP) (B9H)............................................................................................................................. 49  
8.28 RELEASE FROM DEEP POWER-DOWN (ABH) ............................................................................................................... 49  
8.29 READ UNIQUE ID (4BH).......................................................................................................................................... 50  
8.30 READ IDENTIFICATION (RDID) (9FH/9EH)................................................................................................................. 51  
8.31 PROGRAM/ERASE SUSPEND (PES) (75H)................................................................................................................... 52  
8.32 PROGRAM/ERASE RESUME (PER) (7AH) ................................................................................................................... 53  
8.33 ERASE SECURITY REGISTERS (44H) ............................................................................................................................ 53  
8.34 PROGRAM SECURITY REGISTERS (42H)....................................................................................................................... 54  
8.35 READ SECURITY REGISTERS (48H) ............................................................................................................................. 55  
8.36 INDIVIDUAL BLOCK/SECTOR LOCK (36H)/UNLOCK (39H)/READ (3DH)........................................................................... 56  
8.37 GLOBAL BLOCK/SECTOR LOCK (7EH) OR UNLOCK (98H)............................................................................................... 58  
8.38 ENABLE RESET (66H) AND RESET (99H)..................................................................................................................... 59  
8.39 READ SERIAL FLASH DISCOVERABLE PARAMETER (5AH)................................................................................................. 59  
9
ELECTRICAL CHARACTERISTICS ..............................................................................................................61  
9.1  
9.2  
9.3  
9.4  
9.5  
9.6  
POWER-ON TIMING................................................................................................................................................ 61  
INITIAL DELIVERY STATE ........................................................................................................................................... 61  
ABSOLUTE MAXIMUM RATINGS ................................................................................................................................ 61  
CAPACITANCE MEASUREMENT CONDITIONS................................................................................................................. 62  
DC CHARACTERISTICS.............................................................................................................................................. 63  
AC CHARACTERISTICS .............................................................................................................................................. 66  
10  
ORDERING INFORMATION........................................................................................................................74  
10.1 VALID PART NUMBERS ............................................................................................................................................ 75  
PACKAGE INFORMATION .........................................................................................................................77  
11  
11.1 PACKAGE SOP16 300MIL ...................................................................................................................................... 77  
11.2 PACKAGE WSON8 (8X6MM)................................................................................................................................... 77  
11.3 PACKAGE TFBGA-24BALL (5X5 BALL ARRAY)............................................................................................................. 79  
11.4 PACKAGE WLCSP(3-2-3 BALL ARRAY) ....................................................................................................................... 80  
12  
REVISION HISTORY....................................................................................................................................81  
GD25LB512ME-Rev1.5  
3
December 2022  

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