■ Specifications and Test Methods
No Item
Specification
Test Method(Ref. Standard:AEC-Q200)
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1 Pre-and Post-Stress
Electrical Test
Appearance
Capacitance Change
Q or D.F.
No defects or abnormalities.
Within +/-2%
Within the specified initial value.
More than 10000MΩ
Mounting method
Test Temperature
Test Time
Solder the capacitor on the test substrate
150+/-3℃
1000+/-12h
2 High Temperature
Exposure (Storage)
I.R.(Room Temp.)
Post-treatment
Non treatment:Let sit for 24+/-2hours at room temperature, then measure.
Appearance
Capacitance Change
Q or D.F.
No defects or abnormalities.
Within +/-2%
Within the specified initial value.
More than 10000MΩ
Mounting method
Cycles
Temperature Cycling
Reflow solder the capacitor on the test substrate
1000cycles
3 Temperature Cycling
I.R.(Room Temp.)
Post-treatment
Per EIA-469
Non treatment:Let sit for 24+/-2hours at room temperature, then measure.
Appearance
No defects or abnormalities.
4 Destructive Physical
Analysis
Appearance
Capacitance Change
Q or D.F.
No defects or abnormalities.
Within +/-2%
Q≧350
Mounting method
Test Time
Solder the capacitor on the test substrate
Apply the 24h treatment shown below, 10 consecutive times.
5 Moisture Resistance
Temperature and Humidity cycle
I.R.(Room Temp.)
More than 10000MΩ
Post-treatment
Non treatment:Let sit for 24+/-2hours at room temperature, then measure.
GCM32D5C3A472GX01-00B
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