■ Specifications and Test Methods
No Item
9 Solderability
Specification
Test Method
95% of the terminations is to be soldered evenly and continuously.
Test Method
Flux
Preheat
Kind of Solder
Test Temperature
Test Time
Solder bath method
Solution of rosin ethanol 25(mass)%
80℃ to 120℃、10s to 30s
Sn-3.0Ag-0.5Cu(Lead Free Solder)
245+/-5℃
2+/-0.5s
Measurement Temperature
Shown in Rated value.
DF≦0.1
25℃
10 Capacitance
Measurement Frequency 1.0+/-0.1kHz
Measurement Voltage
1.0+/-0.2Vrms
Measurement Temperature
25℃
11 Q or Dissipation Factor
(D.F.)
Measurement Frequency 1.0+/-0.1kHz
Measurement Voltage
1.0+/-0.2Vrms
Measurement Temperature
Measurement Voltage
Charging Time
More than 10000MΩ
25℃
Rated Voltage
2min
12 Insulation
Resistance(I.R.)
(Room Temperature)
Charge/discharge current 50mA max.
Measurement Temperature
Measurement Voltage
Charging Time
More than 1000MΩ
125℃
Rated Voltage
2min
13 Insulation
Resistance(I.R.)
(High Temperature)
Charge/discharge current 50mA max.
No defects or abnormalities.
Test Voltage
Applied Time
Charge/discharge current 50mA max.
250% of the rated voltage
1s to 5s
14 Voltage proof
15 Board Flex
Appearance
Capacitance Change
Q or D.F.
No defects or abnormalities.
Within +/-10%
Within the specified initial value.
More than 10000MΩ
Mounting method
Pressurization Method
Flexure
Reflow solder the capacitor on the test substrate
Shown in Fig.2
1mm
I.R.(Room Temp.)
Holding Time
60s
Appearance
Capacitance
Q or D.F.
No defects or abnormalities.
Within the specified initial value.
Within the specified initial value.
More than 10000MΩ
Mounting method
Applied Force
Holding Time
Solder the capacitor on the test substrate
2N
60s
16 Terminal Strength
17 Beam Load Test
I.R.(Room Temp.)
Speed supplied the Stress Load
Destruction Value: More than 8N
0.5mm/s
Placement diagram
GCH155R72A222KE01-01B
3