Datasheet > GBU606G

GBU606G

更新时间： 2024-02-06 15:27:21

品牌	Logo	应用领域
钜兴 - JUXING		局域网二极管
页数	文件大小	规格书
2页	1657K
描述
BRIDGE RECTIFIERS

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技术参数
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GBU606G 技术参数

生命周期：	Active	Reach Compliance Code：	compliant
ECCN代码：	EAR99	风险等级：	5.64
Base Number Matches：	1

GBU606G 数据手册

GBU6005G THRU GBU610G

BRIDGE RECTIFIERS

GBU

FEATURES

· UL Recognized File #E469616

DimMin

Max

21.8

· Glass passivated chip junction

22.3

4.1

· Reliable low cost construction utilizing molded

plastic technique

3.5

7.4

7.9

· Ideal for printed circuit board

1.65

2.25

2.05

1.02

4.83

17.5

2.16

2.75

2.3

· Low forward voltage drop

· Low reverse leakage current

· High surge current capability

1.27

5.33

18.0

~ ~

MECHANICAL DATA

Case: Molded plastic, GBU

4.2 X 45°

18.3

3.30

0.46

0.76

18.8

3.56

0.56

1.0

Epoxy: UL 94V-O rate flame retardant

Terminals: Leads solderable per MIL-STD-202,

method 208 guaranteed

Mounting position: Any

Weight: 0.15ounce, 4.0gram

Dimensions in inches and (millimeters)

Maximum Ratings and Electrical Characteristics

Ratings at 25℃ ambient temperature unless otherwise specified.

Single phase, half wave, 60H , resistive or inductive load.

For capacitive load, derate current by 20%.

GBU

606G

GBU GBU UNITS

610G

608G

SYMBOL GBU

GBU

602G

GBU

604G

TYPE NUMBER

GBU

601G

6005G

VRRM

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

VRWM

100

200

140

400

280

600

420

800

560

1000

700

VDC

RMS Reverse Voltage

VRMS

Average Rectified Output Current (Note 1)@T_C=90

I^F(AV)

℃

6.0

Non-Repetitive Peak Forward Surge Current 8.3ms

Single half sine-wave superimposed on rated load

(JEDEC Method)

IFSM

150

@IF=3A

@IF=6A

0.95

1.0

VFM

Forward Voltage per element

Peak Reverse Current

@T =25℃

5.0

500

At Rated DC Blocking Voltage @T =125℃

Rating for fusing (t <8.3ms)

A²s

I t

I²t

C_J

Typical Junction Capacitance per leg (Note 2)

Typical Thermal Resistance per leg (Note 3)

Operating and Storage Temperature Range

RθJA

RθJL

℃/W

10.9

-55to+150

TJ,TSTG

℃

Note:1. Mounted on glass epoxy PC board with 1.3mm²solder pad.

2. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.

3. Device mounted on 50mm x 50mm x 1.6mm Cu Plate Heatsink.

http://www.trr-jx.com

version: 02

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