Global Mixed-mode Technology Inc.
G9161
D1
E1
E
H
L
D
θ
A2
A1
A
SEATING PLANE
e
B
SOP-8 (FD) Package
Note:
1. JEDEC Outline: MS-012 AA/E.P. Version: N/A
2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions and gate burrs shall not ex-
ceed .15mm (.006in) per side.
3. Dimensions “E” does not include inter-lead flash, or protrusions inter-lead flash and protrusions shall not exceed .25mm
(.010in) per side.
DIMENSION IN MM
DIMENSION IN INCH
SYMBOL
MIN.
1.397
0.00
MAX.
1.753
0.13
MIN.
MAX.
0.069
0.005
A
A1
A2
B
0.053
0.000
1.40 TYP
0.055 TYP
0.05 TYP
0.330
4.801
3.810
0.508
5.004
3.988
0.013
0.189
0.150
0.020
0.197
0.157
D
E
e
1.27 TYP
H
5.791
0.508
0°
6.198
0.711
8°
0.228
0.020
0°
0.244
0.028
8°
L
θ
D1
E1
3.048
2.159
3.556.
2.667
0.120
0.085
0.140
0.105
Taping Specification
PACKAGE
SOT-89
Q’TY/BY REEL
1,000 ea
TO-252
2,500 ea
SOT-223
SOP-8 (FD)
2,500 ea
Feed Direction
Typical SOP Package Orientation
Feed Direction
SOT-89、223 Package Orientation
Feed Direction
TO-252 Package Orientation
2,500 ea
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.2
Jul 26, 2006
15