G6Z
Surface-mounting High-frequency Relay
■Precautions
●For general precautions on PCB Relays, refer to the precautions provided in General Information of the Relay Product
Data Book.
Substrate Types
Material:FR-4 glass epoxy (glass cloth impregnated with epoxy
resin and copper laminated to its outer surface)
Thickness: 1.6 mm
Correct Use
● High-frequency Characteristics Measurement Method
and Measurement Substrate
• High-frequency characteristics for the G6Z are measured in
the way shown below. Consult your OMRON representative for
details on 50-Ω models.
Thickness of copper plating: 18 μm
Note 1. The compensation substrate is used when measuring the Relay’s
insertion loss. The insertion loss is obtained by subtracting the measured
value for the compensation substrate from the measured value with the
Relay mounted to the high-frequency measurement substrate.
Note 2. For convenience, the diagrams of the high-frequency measurement
substrates given here apply both to models with an E-shape terminal
structure and to models with a Y-shape terminal structure.
Note 3. Be sure to mount a standoff tightly to the through-hole substrate.
Note 4. Use measuring devices, connectors, and substrates that are
appropriate for 50Ω and 75Ω respectively.
Measurement Method for 75-Ω Models
G6Z
Network vector analyzer
(Agilent Technologies)
75-Ω
terminating
Note 5. Ensure that there is no pattern under the Relay. Otherwise, the
impedance may be adversely affected and the Relay may not be able
to attain its full characteristics.
resistance
HP8753D
50-Ω/75-Ω adapter
(Agilent Technologies)
11852B-004
●Handling
• Do not use the Relay if it has been dropped. Dropping the
Relay may adversely affect its functionality.
Through-hole Substrate (75-Ω Models, E-shape or Y-shape)
40
30
0.4
1.4
4-dia.
through-hole
• Protect the Relay from direct sunlight and keep the Relay
under normal temperature, humidity, and pressure.
• Use the Relay as soon as possible after opening the
moistureproof package. If the Relay is left for a long time after
opening the moisture-proof package, the appearance may
suffer and seal failure may occur after the solder mounting
process. To store the Relay after opening the moisture-proof
package, place it into the original package and sealed the
package with adhesive tape.
(Unit: mm)
G
6
Z
3.59
40 30
1
0.95
6.3
• When washing the product after soldering the Relay to a PCB,
use a water-based solvent or alcohol-based solvent, and keep
the solvent temperature to less than 40°C. Do not put the relay
in a cold cleaning bath immediately after soldering.
0.6-dia.
through-hole
●Claw Securing Force During Automatic Mounting
• During automatic insertion of Relays, be sure to set the
securing force of each claw to the following so that the Relay’s
SMD-type Substrate (75-Ω Models, E-shape or Y-shape)
40
4-dia.
through-hole
30
characteristics will be maintained.
1.4
C
(Unit: mm)
0.4
B
Direction A: 4.90 N max.
0.6-dia.
through-hole
Direction B: 4.90 N max.
Direction C: 4.90 N max.
Secure the claws to the shaded area. Do not attach them to the center
area or to only part of the Relay.
40 30
3.91
1
0.95
6.3
●Latching Relay Mounting
• Make sure that the vibration or shock that is generated from
other devices, such as Relays, on the same panel or substrate
and imposed on the Latching Relay does not exceed the rated
value, otherwise the set/reset status of the Latching Relay may
be changed. The Latching Relay is reset before shipping. If
excessive vibration or shock is imposed, however, the Latching
Relay may be set accidentally. Be sure to apply a reset signal
before use.
Substrate for High-frequency Characteristic Compensation
(75-Ω Models, E-shape or Y-shape)
30.7
4-dia.
(Unit: mm)
20
through-hole
●Coating
• Do not use silicone coating to coat the Relay when it is
mounted to the PCB. Do not wash the PCB after the Relay is
mounted using detergent containing silicone. Otherwise, the
detergent may remain on the surface of the Relay.
0.6-dia.
through-hole
1
0.95
40 30
●Repeatability
• Contact your OMRON representative if the Relay will be used
in an application that requires high repeatability in
high-frequencycharacteristics for the microload region. (Such
applications include testing and measurement equipment and
ATE applications.)
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