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G6ZK-1FE-A9VDCTR PDF预览

G6ZK-1FE-A9VDCTR

更新时间: 2023-02-15 00:00:00
品牌 Logo 应用领域
欧姆龙 - OMRON /
页数 文件大小 规格书
13页 2406K
描述
RF Relay

G6ZK-1FE-A9VDCTR 数据手册

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G6Z  
Surface-mounting High-frequency Relay  
Precautions  
For general precautions on PCB Relays, refer to the precautions provided in General Information of the Relay Product  
Data Book.  
Substrate Types  
Material:FR-4 glass epoxy (glass cloth impregnated with epoxy  
resin and copper laminated to its outer surface)  
Thickness: 1.6 mm  
Correct Use  
High-frequency Characteristics Measurement Method  
and Measurement Substrate  
• High-frequency characteristics for the G6Z are measured in  
the way shown below. Consult your OMRON representative for  
details on 50-Ω models.  
Thickness of copper plating: 18 μm  
Note 1. The compensation substrate is used when measuring the Relay’s  
insertion loss. The insertion loss is obtained by subtracting the measured  
value for the compensation substrate from the measured value with the  
Relay mounted to the high-frequency measurement substrate.  
Note 2. For convenience, the diagrams of the high-frequency measurement  
substrates given here apply both to models with an E-shape terminal  
structure and to models with a Y-shape terminal structure.  
Note 3. Be sure to mount a standoff tightly to the through-hole substrate.  
Note 4. Use measuring devices, connectors, and substrates that are  
appropriate for 50Ω and 75Ω respectively.  
Measurement Method for 75-Ω Models  
G6Z  
Network vector analyzer  
(Agilent Technologies)  
75-Ω  
terminating  
Note 5. Ensure that there is no pattern under the Relay. Otherwise, the  
impedance may be adversely affected and the Relay may not be able  
to attain its full characteristics.  
resistance  
HP8753D  
50-Ω/75-Ω adapter  
(Agilent Technologies)  
11852B-004  
Handling  
• Do not use the Relay if it has been dropped. Dropping the  
Relay may adversely affect its functionality.  
Through-hole Substrate (75-Ω Models, E-shape or Y-shape)  
40  
30  
0.4  
1.4  
4-dia.  
through-hole  
• Protect the Relay from direct sunlight and keep the Relay  
under normal temperature, humidity, and pressure.  
• Use the Relay as soon as possible after opening the  
moistureproof package. If the Relay is left for a long time after  
opening the moisture-proof package, the appearance may  
suffer and seal failure may occur after the solder mounting  
process. To store the Relay after opening the moisture-proof  
package, place it into the original package and sealed the  
package with adhesive tape.  
(Unit: mm)  
G
6
Z
3.59  
40 30  
1
0.95  
6.3  
• When washing the product after soldering the Relay to a PCB,  
use a water-based solvent or alcohol-based solvent, and keep  
the solvent temperature to less than 40°C. Do not put the relay  
in a cold cleaning bath immediately after soldering.  
0.6-dia.  
through-hole  
Claw Securing Force During Automatic Mounting  
• During automatic insertion of Relays, be sure to set the  
securing force of each claw to the following so that the Relay’s  
SMD-type Substrate (75-Ω Models, E-shape or Y-shape)  
40  
4-dia.  
through-hole  
30  
characteristics will be maintained.  
1.4  
C
(Unit: mm)  
0.4  
B
Direction A: 4.90 N max.  
0.6-dia.  
through-hole  
Direction B: 4.90 N max.  
Direction C: 4.90 N max.  
Secure the claws to the shaded area. Do not attach them to the center  
area or to only part of the Relay.  
40 30  
3.91  
1
0.95  
6.3  
Latching Relay Mounting  
• Make sure that the vibration or shock that is generated from  
other devices, such as Relays, on the same panel or substrate  
and imposed on the Latching Relay does not exceed the rated  
value, otherwise the set/reset status of the Latching Relay may  
be changed. The Latching Relay is reset before shipping. If  
excessive vibration or shock is imposed, however, the Latching  
Relay may be set accidentally. Be sure to apply a reset signal  
before use.  
Substrate for High-frequency Characteristic Compensation  
(75-Ω Models, E-shape or Y-shape)  
30.7  
4-dia.  
(Unit: mm)  
20  
through-hole  
Coating  
• Do not use silicone coating to coat the Relay when it is  
mounted to the PCB. Do not wash the PCB after the Relay is  
mounted using detergent containing silicone. Otherwise, the  
detergent may remain on the surface of the Relay.  
0.6-dia.  
through-hole  
1
0.95  
40 30  
Repeatability  
• Contact your OMRON representative if the Relay will be used  
in an application that requires high repeatability in  
high-frequencycharacteristics for the microload region. (Such  
applications include testing and measurement equipment and  
ATE applications.)  
12  

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