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G6ZK-1FE-A PDF预览

G6ZK-1FE-A

更新时间： 2024-01-27 03:43:40
品牌 Logo 应用领域
欧姆龙 - OMRON 继电器
页数 文件大小 规格书
18页 1263K
描述
High-frequency Relay

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中文翻译

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G6ZK-1FE-A 技术参数

是否Rohs认证： 符合生命周期：Obsolete
Reach Compliance Code：unknownECCN代码：EAR99
风险等级：5.73继电器类型：RF RELAY
Base Number Matches：1

G6ZK-1FE-A 数据手册

 浏览型号G6ZK-1FE-A的Datasheet PDF文件第11页浏览型号G6ZK-1FE-A的Datasheet PDF文件第12页浏览型号G6ZK-1FE-A的Datasheet PDF文件第13页浏览型号G6ZK-1FE-A的Datasheet PDF文件第15页浏览型号G6ZK-1FE-A的Datasheet PDF文件第16页浏览型号G6ZK-1FE-A的Datasheet PDF文件第17页 
Safety Precautions  
Substrate for High-frequency Characteristic Compensation  
■ Precautions for Correct Use  
Please observe the following precautions to prevent failure to  
(75-Ω Models, E-shape or Y-shape)  
30.7  
(Unit: mm)  
20  
4-dia. through-hole  
operate, malfunction, or undesirable effect on product performance.  
High-frequency Characteristics Measurement Method  
and Measurement Substrate  
0.6-dia. through-hole  
High-frequency characteristics for the G6Z are measured in the way  
shown below. Consult your OMRON representative for details on  
50-Ω models.  
1
0.95  
40 30  
Measurement Method for 75-Ω Models  
G6Z  
Network vector analyzer  
(Agilent Technologies)  
75-Ω terminating  
resistance  
HP8753D  
Substrate Types  
50Ω/75Ω adapter  
(Agilent Technologies)  
11852B-004  
Material: FR-4 glass epoxy (glass cloth impregnated with epoxy  
resin and copper laminated to its outer surface)  
Thickness: 1.6 mm  
Thickness of copper plating:18 μm  
Note: 1. The compensation substrate is used when measuring the  
Relay’s insertion loss. The insertion loss is obtained by  
subtracting the measured value for the compensation  
substrate from the measured value with the Relay  
Through-hole Substrate (75-Ω Models, E-shape or Y-shape)  
40  
30  
4-dia. through-hole  
0.4  
(Unit: mm)  
mounted to the high-frequency measurement substrate.  
1.4  
Note: 2. For convenience, the diagrams of the high-frequency  
measurement substrates given here apply both to models  
with an E-shape terminal structure and to models with a  
Y-shape terminal structure.  
Note: 3. Be sure to mount a standoff tightly to the through-hole  
substrate.  
3.59  
Note: 4. Use measuring devices, connectors, and substrates that  
40 30  
are appropriate for 50 Ω and 75 Ω respectively.  
1
0.95  
6.3  
Note: 5. Ensure that there is no pattern under the Relay.  
Otherwise, the impedance may be adversely affected and  
the Relay may not be able to attain its full characteristics.  
Handling  
0.6-dia. through-hole  
Do not use the Relay if it has been dropped. Dropping the Relay may  
adversely affect its functionality.  
Protect the Relay from direct sunlight and keep the Relay under nor-  
mal temperature, humidity, and pressure.  
SMD-type Substrate (75-Ω Models, E-shape or Y-shape)  
40  
Flow Soldering  
30  
4-dia. through-hole  
1.4  
0.4  
Solder: JIS Z3282, H63A  
(Unit: mm)  
Soldering temperature: Approx. 250°C (260°C if the DWS method is  
used)  
0.6-dia. through-hole  
Soldering time: Approx. 5 s max. (approx. 2 s for the first time and  
approx. 3 s for the second time if the DWS method is used)  
Be sure to make a molten solder level adjustment so that the solder  
will not overflow on the PCB.  
40 30  
3.91  
0.95  
6.3  
1
354  
High-frequency Relay G6Z  
1...1112131415161718

中文翻译

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