Datasheet > FW830MG

FW830MG

更新时间： 2024-02-10 20:50:30

品牌	Logo	应用领域
其他 - ETC		控制器
页数	文件大小	规格书
245页	1934K
描述
Controller Miscellaneous - Datasheet Reference

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FW830MG 技术参数

Intel^®830 Chipset Family

7.7

Intel 830 Chipset Family Chipset Package Dimensions

Figure 24 outlines the mechanical dimensions for the Intel 830 Chipset family GMCH-M. The package

is a 625-ball grid array (BGA) package.

Figure 24. Intel 830 Chipset Family GMCH-M Package Dimensions

298338-003

Datasheet

245

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