Radial Leaded PTC FUSB Series
FUZETEC
Application:
Low voltage USB equipment
Product Features:
Low resistance, Fast trip time , Lower
Trip-to-hold Ratio
Operation Current: 750mA ~2.5A
Maximum Voltage: 16V/30V
Temperature Range: -40ꢀ to 85ꢀ
Agency Approvals: UL(E211981),
C-UL(E211981),
TUV (R3-50004084)
Electrical characteristics(23ꢀ)
Resistance
Hold
Trip
Max.Time Maximum Rated Typical
Tolerance
RMIN
Part
Current Current
to Trip
Current
Voltage Power
Number
R1MAX
IT,A at 8A at 5xIH
IMAX,A VMAX,Vdc Pd, W
Ω
Ω
IH,A
0.75
0.90
1.10
1.20
1.35
1.55
1.60
1.85
2.50
FUSB075
FUSB090
FUSB110
FUSB120
FUSB135
FUSB155
FUSB160
FUSB185
FUSB250
1.30
1.80
2.20
2.00
2.70
2.70
3.20
3.70
5.00
0.4
1.2
2.3
0.5
4.5
0.6
9.0
10.0
--
40
40
40
40
40
40
40
40
40
16/30
16/30
16/30
16/30
16/30
16/30
16/30
16/30
16/30
0.3
0.6
0.7
0.6
0.8
0.7
0.9
1.0
1.2
0.080
0.070
0.050
0.040
0.040
0.030
0.030
0.030
0.020
0.23
0.18
0.14
0.14
0.12
0.12
0.11
0.09
0.07
5.9
6.6
--
7.3
--
8.0
8.7
40.0 10.3
I
H
=Hold current-maximum current at which the device will not trip at 23ꢀ still air.
=Trip current-minimum current at which the device will always trip at 23ꢀ still air.
MAX=Maximum voltage device can withstand without damage at its rated current.
MAX= Maximum fault current device can withstand without damage at rated voltage (V max).
Pd=Typical power dissipated from device when in the tripped state in 23ꢀ still air environment.
I
T
V
I
RMIN=Minimum device resistance at 23ꢀ.
R1MAX=Maximum device resistance at 23ꢀ, 1 hour after tripping .
Physical specifications:
Lead material: Tin plated copper,24 AWG.
Soldering characteristics: Soldering ability per ANSI/J-STD 002
Solder heat withstand per IEC 68-2-20
FUSB 120 :Test Tb, method 1a, condition a; can withstand 5 second at 260ꢀ ꢁ5ꢀ
All others: Test Tb, method 1a, condition a; can withstand 10 second at 260ꢀ ꢁ5ꢀ
Insulating coating:Flame retardant epoxy polymer ,meets UL 94V-O requirement.
1
DB LECTRO Inc., 3600-I, boulevard Matte, Brossard, QC J4Y 2Z2